1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix F 2 Provides “flags” or other cautionary notes embedded within the design software triggered by potentially undesirable environmental characteristics of the process/material/product 2 Able to integrate DFE concerns into the overall (larger) trade-off analysis (consider environmental impact/factors as related to performance, costs, material availability, learning curve associated with new processes/technologies, etc.) 4 Provides access to “intelligent” on-line DFE guidelines 1 Provides environmental regulations/compliance data/environmental policies and procedures Other: ____________________________________________________________ Scope (Please rank the importance of the features below as Low, Med, or High) 2 Applicable to mechanical designs 2 Applicable to electromechanical designs 3 Applicable to simple electronic designs 4 Applicable to complex electronic designs 6 Applicable to software designs, materials 3 Applicable to parts 1 Applicable to processes 5 Applicable to system engineering 1 Applicable to various areas of electronics manufacturing (packaging, discrete components, printed wiring boards, interconnects, etc.) Other: ____________________________________________________________ General Compatibility (Please rank the importance of the features below as Low, Med, or High) 3 Is compatible with Total Quality Management (TQM) and Just-in-Time maintenance approaches 1 Is compatible with ISO 9000 2 Is compatible with ISO 14000/TC207 4 Applicable to supplier line management 1 Is compatible with concurrent engineering design and management approaches Other: ____________________________________________________________ Environmental Results Generated (Please rank the importance of the features below as Low, Med, or High) 9 Includes a quantitative “green” rating with little or no accompanying environmental impact data 236
Appendix F 5 Quantifies and reports impact to air, water, and land as well as discharge, emissions, etc. 8 Provides a full-scale LCA on the product (including stages of raw material extraction, manufacturing, maintenance, and disposition/disposal options) 7 Provides an LCA on manufacturing stage(s) only 2 Provides relative environmental desirability ranking or ratings of technology tradeoff decisions 1 Provides relative environmental desirability ranking or ratings of materials/process selection 4 Provides direct cause and effect linkage between product design features and potential/adverse environmental effects 1 Able to evaluate recyclability 6 Able to evaluate durability 4 Able to evaluate reparability 3 Able to evaluate reduced-packaging (shipping) opportunities Other: ____________________________________________________________ III. DFE Tools--General Scope Please fill in the following matrix, using the sample responses as a guide. Sample Matrix Responses: Design Activities Concept How many people involved? Design Methodology Use CAD tools? DFE tool Useful? Development (estimation) 6-7 Group meetings No Yes Simulation 1 Individual designers with tools Yes Yes Design/Manufacturing Activities Concept Development (estimation) Simulation Synthesis Physical Design Verification Prototype Manufacturing How many people involved? Design Methodology Use CAD tools? DFE tool Useful? 237
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Page 217 and 218: Appendix E Appendix E. Development
Page 219 and 220: Appendix E releases with component
Page 221 and 222: Appendix E 2 1 ITEM: Common Sense I
Page 223 and 224: Appendix E 6 1 ITEM: U.S. Industria
Page 225 and 226: Appendix E 1 ITEM: Waste Wi$e 2 SOU
Page 227 and 228: Appendix E 14 1 ITEM: 33/50 Program
Page 229 and 230: Appendix E 3 CONTENT: This Departme
Page 231 and 232: Appendix E clearinghouses, database
Page 233 and 234: 5 COST: Free access to all data/inf
Page 235 and 236: Appendix E 34 1 ITEM: EMPF (Electro
Page 237 and 238: Appendix E 37 1 ITEM: I3LA (Initiat
Page 239 and 240: Appendix E 40 1 ITEM: Access EPA 2
Page 241 and 242: Appendix E 7 PERTINENCE: Probably n
Page 243 and 244: Appendix E 3 CONTENT: Large indexed
Page 245 and 246: Appendix E 55 1 ITEM: UCLA Center f
Page 247 and 248: Item # Type Source of Item Access C
Page 249 and 250: Appendix F. Survey of Tool Characte
Page 251 and 252: [Definitions for the design activit
Page 253: Human Interface (Please rank the im
Page 257 and 258: Appendix G Appendix G. Building Blo
Page 259 and 260: Appendix G The Nordic cooperation g
Page 261: Appendix G undertaken to assess env
Page 264 and 265: Appendix H If no accrual is made be
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Page 268 and 269: Appendix I 250
Page 270 and 271: Appendix J The ordinance requires U
Page 272 and 273: Appendix J 254 150,001 to 600,000 1
Page 274 and 275: Appendix J Germany (Proposed; effec
Page 276 and 277: References [16] Waitz and Corbet,
Page 278: References 260
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