1996 Electronics Industry Environmental Roadmap - Civil and ...

More documents

Recommendations

Info

Emerging Technologies 6.4.4 Fully Additive Substrates for PWBs One of the most important environmental accomplishment in PWB development would be the establishment of a fully additive printed wiring board process. The traditional PWB process has relied mainly on a subtractive print and etch process for forming copper conductors. Full build additive approaches for double- and single-sided boards have been in use for over twenty years. Processes that use full build to make multi-layer boards have more recently been developed. Since, in the additive process, most, or all, of the etching steps are eliminated, the use of additive processes would contribute significantly to reducing the waste stream. 6.4.5 Point-of-Use Generation An important issue in any manufacturing environment where hazardous materials must be stored and maintained is the safety and stability of the storage environment. In situations where otherwise benign materials are combined through chemical or material formulations to become a hazardous material, point-of-use generation systems would only create the required materials or chemicals, at such time, and at the precise point, that they are to be applied in the production process. These point-of-use generation systems would, therefore, eliminate the storage of otherwise hazardous substances, and by doing so eliminate a significant concern in the fab environment. 6.4.6 Integrated Design for Environment At the heart of electronics processing are well-integrated and well-established tools and technologies for design. In the course of new technology computer-aided design systems currently being developed, it is essential that any clean electronics initiative would promote, support, and facilitate the development of effective, robust, and easily-integrated design tools. Through the establishment of a collaborative industry assessment program, in which DFE requirements and tools could be identified and evaluated, subsequent activities could focus on the establishment of frameworks for tool integration and linkages with other elements of the design system. DFE is discussed in detail in Chapter 4 of this Roadmap. 6.4.7 Computer System End-Of-Life Management A comprehensive “grand challenge” program would be the establishment of processes and technologies to support improved end-of-life management. This would include design issues relating to remanufacturing and recycling at end-of-life, materials identification technologies to support automated sorting upon disassembly, dematable connectors and other approaches to improve the ease of disassembly, and intelligent support systems to facilitate product tracking throughout multiple life cycles. Effectively implemented, these kinds of approaches could greatly increase the feasibility of successful end-of-life management/disposition systems and decrease potentially valuable product being sent to the waste stream. Disposition is discussed in Chapter 5 of this report. 6.5 Conclusion The rapid advancement of electronics enables remarkable new capabilities in products and systems. Conversely, those new capabilities can be applied to improve the process by which electronic components are manufactured and produced. Particular emphasis should be placed on the elimination of widely used and hazardous materials development, adoption of 114
Emerging Technologies environmentally benign processes, and aggressive support for innovation and dissemination of new technologies. Participation by companies across the full life cycle of electronic product production will make a significant contribution to improving the environmental performance throughout the industry. Table 6-5 lists the needs for emerging technologies identified during this roadmapping exercise. 115
Page 1 and 2:
MCC TECHNICAL REPORT MCC-ECESM-001-
Page 3 and 4:
MCC Technical Report Document No. M
Page 5 and 6:
Table of Contents Electronics Indus
Page 7 and 8:
Electronics Industry Environmental
Page 9:
Page 12 and 13:
Page 15 and 16:
Executive Summary Electronics Indus
Page 17 and 18:
Page 19 and 20:
1.0 Introduction Introduction 1.1 O
Page 21 and 22:
Introduction These kinds of cross-c
Page 23 and 24:
Introduction Strategic Priority Nee
Page 25 and 26:
Introduction Tactical Priority Need
Page 27 and 28:
2.0 Strategic Business Opportunitie
Page 29 and 30:
Strategic Business Opportunities To
Page 31 and 32:
Strategic Business Opportunities Go
Page 33 and 34:
Strategic Business Opportunities co
Page 35 and 36:
Strategic Business Opportunities Th
Page 37 and 38:
Strategic Business Opportunities -
Page 39 and 40:
Environmental Cost Accounting at AT
Page 41 and 42:
Strategic Business Opportunities Pr
Page 43 and 44:
Strategic Business Opportunities sm
Page 45 and 46:
Strategic Business Opportunities pr
Page 47 and 48:
Strategic Business Opportunities en
Page 49:
Priority Need Task 1. Knowledge of
Page 52 and 53:
Information and Knowledge Systems m
Page 54 and 55:
Information and Knowledge Systems T
Page 56 and 57:
Information and Knowledge Systems T
Page 58 and 59:
Information and Knowledge Systems 4
Page 60 and 61:
Information and Knowledge Systems A
Page 62 and 63:
Page 64 and 65:
Information and Knowledge Systems m
Page 66 and 67:
Page 69 and 70:
Design for Environment: Evolution a
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
5. Models to support more comprehen
Page 81 and 82: 5.0 Disposition Disposition 5.1 Obj
Page 83 and 84: Disposition due date are called con
Page 85 and 86: Disposition 5.4.1 The Consumer/Comm
Page 87 and 88: Disposition 5.4.2 Recycled Material
Page 89 and 90: Disposition One of the greatest cha
Page 91 and 92: Disposition Assistance (OEA) submit
Page 93 and 94: Disposition provision in other inst
Page 95 and 96: Disposition The proposals strongly
Page 97 and 98: 5.5.5 Summary: Lessons from Program
Page 99 and 100: Disposition The left side of the mo
Page 101 and 102: Disposition and government for esta
Page 103 and 104: Disposition Recycling: The collecti
Page 105: Disposition 87
Page 108 and 109: Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
Page 114 and 115: Emerging Technologies Therefore, gi
Page 116 and 117: Emerging Technologies Printed Wirin
Page 118 and 119: Emerging Technologies 100 ensures f
Page 120 and 121: Emerging Technologies Etch Chemical
Page 122 and 123: Emerging Technologies 104 Fully Sub
Page 124 and 125: Emerging Technologies adhesives and
Page 126 and 127: Emerging Technologies 108 have sign
Page 128 and 129: Emerging Technologies 110 of automa
Page 130 and 131: Emerging Technologies 112 managemen
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
Page 151 and 152: Appendix A IPC “The coordination
Page 153 and 154: Appendix A OIDA Specific technical
Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
Page 159 and 160: Appendix A SIA/SEMATECH Hand-in-han
Page 161 and 162: Appendix A SIA/SEMATECH Chemical, e
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
Page 167 and 168: SIA/SEMATECH Benchmarking NEMI Need
Page 169 and 170: Appendix A IPC Purchasing Suppliers
Page 171 and 172: Appendix B. The Ten Ceres Principle
Page 173 and 174: Appendix C. The ICC Business Charte
Page 175 and 176: Appendix D Appendix D. Statistical
Page 177 and 178: SIC CODE Table 1. Demographic and w
Page 179 and 180: Appendix D Table 2. Correlation of
Page 181 and 182: SIC Code Table 3. Costs of fuels an
Page 183 and 184:
3672 Printed Circuit Boards 3674 Se
Page 185 and 186:
1 Value of shipments for product by
Page 187 and 188:
3676- Electronic resistors 3677- El
Page 189 and 190:
Appendix D Product Product Company
Page 191 and 192:
Page 193 and 194:
Page 195 and 196:
Page 197 and 198:
Page 199 and 200:
Page 201 and 202:
Appendix D 183
Page 203 and 204:
Appendix D Table 9. Quantity and va
Page 205 and 206:
Page 207 and 208:
Page 209 and 210:
Key to Table 9: - Represents zero.
Page 211 and 212:
SIC Code 36 361 Table 10. Air pollu
Page 213 and 214:
SIC Code 36 361 362 Table 11. Pollu
Page 215 and 216:
SIC Code 36 Appendix D Table 12. Po
Page 217 and 218:
Appendix E Appendix E. Development
Page 219 and 220:
Appendix E releases with component
Page 221 and 222:
Appendix E 2 1 ITEM: Common Sense I
Page 223 and 224:
Appendix E 6 1 ITEM: U.S. Industria
Page 225 and 226:
Appendix E 1 ITEM: Waste Wi$e 2 SOU
Page 227 and 228:
Appendix E 14 1 ITEM: 33/50 Program
Page 229 and 230:
Appendix E 3 CONTENT: This Departme
Page 231 and 232:
Appendix E clearinghouses, database
Page 233 and 234:
5 COST: Free access to all data/inf
Page 235 and 236:
Appendix E 34 1 ITEM: EMPF (Electro
Page 237 and 238:
Appendix E 37 1 ITEM: I3LA (Initiat
Page 239 and 240:
Appendix E 40 1 ITEM: Access EPA 2
Page 241 and 242:
Appendix E 7 PERTINENCE: Probably n
Page 243 and 244:
Appendix E 3 CONTENT: Large indexed
Page 245 and 246:
Appendix E 55 1 ITEM: UCLA Center f
Page 247 and 248:
Item # Type Source of Item Access C
Page 249 and 250:
Appendix F. Survey of Tool Characte
Page 251 and 252:
[Definitions for the design activit
Page 253 and 254:
Human Interface (Please rank the im
Page 255 and 256:
Appendix F 5 Quantifies and reports
Page 257 and 258:
Appendix G Appendix G. Building Blo
Page 259 and 260:
Appendix G The Nordic cooperation g
Page 261:
Appendix G undertaken to assess env
Page 264 and 265:
Appendix H If no accrual is made be
Page 266 and 267:
Appendix H 248
Page 268 and 269:
Appendix I 250
Page 270 and 271:
Appendix J The ordinance requires U
Page 272 and 273:
Appendix J 254 150,001 to 600,000 1
Page 274 and 275:
Appendix J Germany (Proposed; effec
Page 276 and 277:
References [16] Waitz and Corbet,
Page 278:
References 260
show all

1996 Electronics Industry Environmental Roadmap - Civil and ...

Create successful ePaper yourself

Delete template?

Save as template?