1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix G in Environmental, Safety, and Health Issues in IC Production provides a good example of efforts in data-gathering and process improvements that are technology-, cost-, and environmentoriented. IMEC is serving an important need for future IC processing and demonstrates successful interaction within a highly competitive industry. The IMEC program on ultra-clean processing technology is aimed at reducing resources and waste in IC fabrication, examining: resource reduction, re-use, waste treatment, and alternative chemicals and materials. The goal of the program is to move from ultra-clean requirements to “just-clean-enough.” 29 Some of the major goals are to: 242 Study the possibilities of reducing the use of the source material, such as the reagents chemicals, gases, and deionized (DI)-water; Reduce the use of volatile organic compounds if possible, capturing waste and re-using it; and Optimize the design of DI-rinse tanks (stating that currently only approximately 10% of the rinse water is effectively used) and the control of DI-water contamination to enable the re-use of the rinse water. One outcome of this effort is the “IMEC-Clean,” an RCA clean that reduces the steps from three to two, and replaces sulfuric acid-hydrogen peroxide solution with an ionized DI-water. IMEC has worked with a range of U.S. and European companies (e.g., Intel, TI, Motorola, Philips, Ashland, BOC, Wacker, and ASM), to enable such improvements in semiconductor processes. The Institute’s experience in microelectronics packaging and interconnect, and its work with designers to determine their system needs, is enabling the development of new design methods and tools. This experience could potentially be tapped for electronic materials and process studies that provide additional support to DFE practices for products beyond semiconductors. Closing Comments The volume of electronics-related environmental impact data is not keeping pace with the growing desire to consider environmental implications in design and manufacturing. This is not surprising given that the data needed to support environmentally conscious decisions requires significant resources to conduct environmental impact assessments and/or life cycle assessments and compile lists of constituent materials in electronic products. Although various groups in the U.S. and Europe question the efficiency and outright utility of full-scale life cycle assessments, the need will continue to grow for data to support design and process decisions that consider environmental issues along with traditional factors (design-forenvironment, or DFE). This appendix briefly outlined four efforts, completed or ongoing, in Europe to create building blocks of DFE infrastructure. Clearly, more projects must be programs. IMEC has a broad range of expertise from software to hardware, and is a center of excellence for microelectronics, developing and characterizing process steps such as optical lithography and full processes such as 0.35-micrometer CMOS devices. At the microsystem level, IMEC’s work includes packaging and interconnect technologies and techniques and material characterization. 29 Information based on IMEC presentation to MCC in June 1995 as part of the Open-Microprocessor Initiative mission to the U.S.
Appendix G undertaken to assess environmental impact, or load, of the wide variety of materials used in the electronics industry. These four European efforts may provide a stepping stone, if not models, for continued data gathering and impact assessments. 243
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Page 217 and 218: Appendix E Appendix E. Development
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Page 227 and 228: Appendix E 14 1 ITEM: 33/50 Program
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Page 231 and 232: Appendix E clearinghouses, database
Page 233 and 234: 5 COST: Free access to all data/inf
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Page 237 and 238: Appendix E 37 1 ITEM: I3LA (Initiat
Page 239 and 240: Appendix E 40 1 ITEM: Access EPA 2
Page 241 and 242: Appendix E 7 PERTINENCE: Probably n
Page 243 and 244: Appendix E 3 CONTENT: Large indexed
Page 245 and 246: Appendix E 55 1 ITEM: UCLA Center f
Page 247 and 248: Item # Type Source of Item Access C
Page 249 and 250: Appendix F. Survey of Tool Characte
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Page 255 and 256: Appendix F 5 Quantifies and reports
Page 257 and 258: Appendix G Appendix G. Building Blo
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Page 264 and 265: Appendix H If no accrual is made be
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Page 268 and 269: Appendix I 250
Page 270 and 271: Appendix J The ordinance requires U
Page 272 and 273: Appendix J 254 150,001 to 600,000 1
Page 274 and 275: Appendix J Germany (Proposed; effec
Page 276 and 277: References [16] Waitz and Corbet,
Page 278: References 260
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