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1996 Electronics Industry Environmental Roadmap - Civil and ...

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Emerging Technologies<br />

Outerlayer Processing: Outerlayer processing represents the final major process step to<br />

complete a multilayer circuit board. Through-hole plating adds metal not only to the hole<br />

walls themselves, but also to the outer layers of the laminated innerlayer cores. These exterior<br />

surfaces must ultimately be patterned to provide the necessary connections for<br />

circuit components later added to the PWB. Most PWB outerlayers are produced through<br />

a subtractive process, in which copper is selectively removed from the plated PWB to<br />

form a circuit [35]. Semi-additive or fully-additive processing, in which the manufacturer<br />

forms the copper image by selectively plating copper onto the substrate, are alternative<br />

outerlayer processes emerging in the manufacturing base. Improvement of additive metal<br />

deposition technology, according to the IPC, requires higher precision, consistency in<br />

resolution, <strong>and</strong> dem<strong>and</strong>s a focused program of research for new equipment, processes,<br />

<strong>and</strong> infrastructure [36].<br />

Figures 6-3 through 6-4 summarizes the overall multilayering process including lamination, drilling,<br />

<strong>and</strong> outerlayer processing. Subtractive, semi-additive, <strong>and</strong> fully-additive techniques for<br />

outerlayer processing are detailed.<br />

Final Surface Preparation: Numerous surface finishes are possible once all copper<br />

circuitry has been patterned on the PWB. Depending on the component assembly<br />

processes to be used on the circuit board, gold, solder, or bare copper (with a anti-tarnish<br />

coating) are possible. In one common process termed hot-air solder leveling (HASL), the<br />

panel is dipped into molten solder, <strong>and</strong> then blasted with hot air to even out the solder<br />

coating on which customers will mount parts.<br />

<strong>Environmental</strong> Impacts: PWB manufacturing is a complicated process <strong>and</strong> includes<br />

several steps that use significant quantities of chemicals <strong>and</strong> metals. On average, the<br />

waste stream constitutes 92%—<strong>and</strong> the final product just 8%—of the total weight of the<br />

materials used in the PWB production process. Approximately 80% of the waste<br />

produced is hazardous [37], <strong>and</strong> most of the waste is aqueous, including a range of<br />

hazardous chemicals. Table 6-3 illustrates some example environmental issues resulting<br />

from the more common process steps as outlined above.<br />

Process <strong>Environmental</strong> Issues/Impact<br />

Base material manufacturing Chemical waste stream from copper foil<br />

manufacturing, resin production<br />

Lamination Energy consumption<br />

Drilling Solid waste products from drilling<br />

Desmear Chemical <strong>and</strong>/or gaseous waste from etchback of<br />

drilled PWB<br />

Through hole/outerlayer plating Chemical waste from electrolytic <strong>and</strong> electroless<br />

copper baths<br />

Resist develop Chemical waste from dissolved resist <strong>and</strong> spent<br />

developer<br />

Resist strip Chemical waste from dissolved resist <strong>and</strong> spent<br />

stripper<br />

101

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