1996 Electronics Industry Environmental Roadmap - Civil and ...
1996 Electronics Industry Environmental Roadmap - Civil and ...
1996 Electronics Industry Environmental Roadmap - Civil and ...
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Emerging Technologies<br />
Outerlayer Processing: Outerlayer processing represents the final major process step to<br />
complete a multilayer circuit board. Through-hole plating adds metal not only to the hole<br />
walls themselves, but also to the outer layers of the laminated innerlayer cores. These exterior<br />
surfaces must ultimately be patterned to provide the necessary connections for<br />
circuit components later added to the PWB. Most PWB outerlayers are produced through<br />
a subtractive process, in which copper is selectively removed from the plated PWB to<br />
form a circuit [35]. Semi-additive or fully-additive processing, in which the manufacturer<br />
forms the copper image by selectively plating copper onto the substrate, are alternative<br />
outerlayer processes emerging in the manufacturing base. Improvement of additive metal<br />
deposition technology, according to the IPC, requires higher precision, consistency in<br />
resolution, <strong>and</strong> dem<strong>and</strong>s a focused program of research for new equipment, processes,<br />
<strong>and</strong> infrastructure [36].<br />
Figures 6-3 through 6-4 summarizes the overall multilayering process including lamination, drilling,<br />
<strong>and</strong> outerlayer processing. Subtractive, semi-additive, <strong>and</strong> fully-additive techniques for<br />
outerlayer processing are detailed.<br />
Final Surface Preparation: Numerous surface finishes are possible once all copper<br />
circuitry has been patterned on the PWB. Depending on the component assembly<br />
processes to be used on the circuit board, gold, solder, or bare copper (with a anti-tarnish<br />
coating) are possible. In one common process termed hot-air solder leveling (HASL), the<br />
panel is dipped into molten solder, <strong>and</strong> then blasted with hot air to even out the solder<br />
coating on which customers will mount parts.<br />
<strong>Environmental</strong> Impacts: PWB manufacturing is a complicated process <strong>and</strong> includes<br />
several steps that use significant quantities of chemicals <strong>and</strong> metals. On average, the<br />
waste stream constitutes 92%—<strong>and</strong> the final product just 8%—of the total weight of the<br />
materials used in the PWB production process. Approximately 80% of the waste<br />
produced is hazardous [37], <strong>and</strong> most of the waste is aqueous, including a range of<br />
hazardous chemicals. Table 6-3 illustrates some example environmental issues resulting<br />
from the more common process steps as outlined above.<br />
Process <strong>Environmental</strong> Issues/Impact<br />
Base material manufacturing Chemical waste stream from copper foil<br />
manufacturing, resin production<br />
Lamination Energy consumption<br />
Drilling Solid waste products from drilling<br />
Desmear Chemical <strong>and</strong>/or gaseous waste from etchback of<br />
drilled PWB<br />
Through hole/outerlayer plating Chemical waste from electrolytic <strong>and</strong> electroless<br />
copper baths<br />
Resist develop Chemical waste from dissolved resist <strong>and</strong> spent<br />
developer<br />
Resist strip Chemical waste from dissolved resist <strong>and</strong> spent<br />
stripper<br />
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