1996 Electronics Industry Environmental Roadmap - Civil and ...

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Introduction An important distinction in this year’s edition of the Roadmap is the emphasis on strategic business opportunities, such as design for the environment practices and consumer electronics product disposition. The previous Roadmap, and MCC’s report that preceded it entitled “Life Cycle Assessment of a Computer Workstation,” focused much more heavily on environmental issues associated with particular technologies or component areas. Since MCC’s environmental roadmapping efforts first began, technology roadmaps have been completed, or are under way, by several other key electronics associations: 2 The Semiconductor Industry Association (SIA), in association with SEMATECH, has developed the National Technology Roadmap for Semiconductors. The Institute for Interconnecting and Packaging Electronic Circuits (IPC) has developed a National Technology Roadmap for Interconnects. The National Electronics Manufacturing Initiative (NEMI) has developed a broad roadmap for information hardware, encompassing a variety of specific technology segments including both technology issues and policy/infrastructure issues. The Optoelectronics Industry Development Association (OIDA) produced a roadmap for optoelectronic technology, including a section addressing displays. The U.S. Display Consortium (USDC) is in the process of developing a comprehensive roadmap for the flat panel display industry. NEMI, in association with a group of leading battery manufacturers, is currently launching an effort to produce a roadmap for energy sources and passive components. These roadmaps generally address the current state of technology, including emerging technologies, the requirements for and impediments to technological advancement, and a variety of policy issues associated with maintaining competitiveness of individual corporations and the entire industry. Most of the roadmaps also address certain cross-cutting challenges, i.e., issues that are pervasive in their importance to technological evolution within the particular electronic segment, although none comprehensively deal with environmental issues. A detailed summary of the various roadmaps can be found in Appendix A. This environmental roadmap has many similar characteristics, but to be effective it must operate at a different level. Given the body of knowledge represented by the other roadmaps, it would be misguided to attempt any significant additional technical analysis of these industry segments. The approach instead is to examine the technical and strategic business opportunities described in the roadmaps and identify those common or pervasive issues that seem to emerge. By doing so, the fundamental, cross-cutting requirements for effective industry action and environmental processes can be identified. For example, the similarity of chemicals, materials, and processes across various industry segments make the pursuit of environmental excellence in the electronics industry an inherently multi-company, and in fact, multi-industry endeavor. Therefore, the development of a true roadmap for environmentally conscious electronic systems manufacturing can only be accomplished through a cross-cutting view—identifying overall industry trends, examining common solutions and the distinctions among the various segment roadmaps, and highlighting opportunities for effective coordination and linkages.
Introduction These kinds of cross-company/cross-industry challenges have led MCC to establish environmentally conscious manufacturing as a priority for its ongoing program of consortial research. 1.2 Why MCC? As a research and development consortium, MCC is dedicated to providing a forum through which diverse interests can convene, share intelligence, map requirements, and pursue a highly leveraged program of industrially-focused research. Furthermore, as a venture operating under the auspices of the National Cooperative Research Act of 1984, companies who participate in consortia such as MCC can do so relatively free of concerns about frivolous anti-trust actions, to the extent their cooperation remains within the bounds of the Act. Therefore, it is consistent with MCC’s mission—and, some would argue, a responsibility of an organization like MCC—to pursue critical issues that are inherently multi-company, multi-industry, or multidisciplinary, or better addressed in a leveraged, collaborative manner. Since 1983, MCC has pursued an aggressive program of research and development in several areas of advanced electronics. MCC’s work has placed it among the leaders in advanced integrated circuit packaging and interconnect, including issues associated with equipment, processes and materials. In carrying out this research effort, MCC has addressed a variety of challenges that affect the environmental impact of the resulting products, including lead alternatives, additive processes, and other cutting edge issues. The relevant projects have been carried out in a consortial manner—based on the collaboration of many of the nation’s leading electronics companies. These activities have provided MCC with significant experience in many of the areas that are emerging as environmental priorities in evolving technologies. 1.3 Priorities from the 1994 Roadmap The 1994 Roadmap addressed key environmental issues for integrated circuit (IC) packaging, printed wiring boards (PWBs) and their assembly, and displays. The 1994 Roadmap also addressed business and strategic planning issues, disposition and end-of-life management, and regulations and standards. One objective of the 1996 Roadmap is to look at the priorities identified in the 1994 Electronics Industry Environmental Roadmap and, through a review process, select the top priority issues that warrant attention in the near term. A sub-group of the Advisory Committee met several times over a period of three months to identify the top priority issues listed below, and categorized them as strategic, longer-term or tactical, near-term goals. In addition to making the issues identified in the previous roadmap more specific, the sub-group suggests organizations that may be appropriate to address the identified priority need. Table 1-1 lists the needs and a sampling of tasks that resulted from the sub-group discussions, and categorized according to the type of need—strategic or tactical. They are listed in descending order of importance. Many of these issues are addressed in greater detail in the remainder of this report. Specifically, the agenda for the 1996 Roadmap has identified several issues that cut across these priorities, and addresses each in the following chapters: Strategic Business Opportunities, Information and Knowledge Systems, 3
Page 1 and 2: MCC TECHNICAL REPORT MCC-ECESM-001-
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Page 5 and 6: Table of Contents Electronics Indus
Page 7 and 8: Electronics Industry Environmental
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Page 15 and 16: Executive Summary Electronics Indus
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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