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1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix A<br />

SIA/SEMATECH Over the time span encompassed by the roadmap, the complexity of<br />

chips <strong>and</strong> systems will grow so dramatically that new approaches based<br />

on far more powerful <strong>and</strong> interoperable tools will be needed to h<strong>and</strong>le<br />

the design <strong>and</strong> test processes.<br />

Already, in many cases, system level integration is limited by existing<br />

CAD tools <strong>and</strong> their inability to let the designer work smoothly up <strong>and</strong><br />

down the levels of abstraction from device details to product<br />

functionality.<br />

Ideally, design will be done using an integrated tool suite that gives the<br />

designer the power to create products starting from customer<br />

specifications <strong>and</strong> working down to the details of wafer fabrication <strong>and</strong><br />

factory economics.<br />

The ideal solution for the design environment would be a formal<br />

database management system used by all tools. This solution will start<br />

with common access interfaces <strong>and</strong> formal approaches for mapping<br />

information between different representations <strong>and</strong> continue through<br />

research directed at more formal DBMS solutions.<br />

Low power is an increasingly critical need for portable <strong>and</strong> mobile<br />

computing <strong>and</strong> communication devices. Good progress has been made<br />

in the past year, <strong>and</strong>, in the near term, st<strong>and</strong>ard logic synthesis methods<br />

can be adapted to create viable solutions. However, their quality relies<br />

heavily on accurate power estimators that are still lacking.<br />

Report emphasizes the need for higher level synthesis with emphasis<br />

on improved optimization of constrained parameters.<br />

Compute-intensive simulation for verifying system <strong>and</strong> chip<br />

functionality must be replaced by formal analysis <strong>and</strong> verification<br />

methodologies.<br />

As performance dem<strong>and</strong>s increase further, IC level cell[?] libraries will<br />

need to be redesigned rapidly to support fine-grain speed-power tuning.<br />

(The report also notes that the trends to be considered are emerging<br />

product styles such as field programmable devices, mixed signal<br />

systems, <strong>and</strong> aggressive packaging strategies.)<br />

The challenge in design is managing the exploding complexity. To<br />

provide the dramatic improvement necessary in the design process as<br />

the complexity of the chips <strong>and</strong> systems increases, two key paradigm<br />

shifts can be identified: (1) point tools giving way to self-consistent<br />

top down design, <strong>and</strong> (2) piecemeal solutions giving way to<br />

hierarchical modeling <strong>and</strong> analysis.<br />

In the area of design, the second across-the-board critical issue is that<br />

of st<strong>and</strong>ards. Interoperability <strong>and</strong> related software tool <strong>and</strong> information<br />

st<strong>and</strong>ards must be improved <strong>and</strong> their acceptance by industry, both<br />

users <strong>and</strong> suppliers, as well as the universities <strong>and</strong> government<br />

organizations, needs to be accelerated.<br />

Drivers for the improvements needed in the near term in design <strong>and</strong><br />

test include the need for more accurate but predictive capabilities at the<br />

detail level <strong>and</strong> the continuous drive for performance, power reduction,<br />

<strong>and</strong> minimum silicon real estate for the extremely complex devices <strong>and</strong><br />

140<br />

systems. They must also be strongly coupled into the synthesis <strong>and</strong> test<br />

process.<br />

(continued)

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