1996 Electronics Industry Environmental Roadmap - Civil and ...

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Design for Environment: Evolution and Tool Needs One of the first steps in developing the 1996 Roadmap was to re-examine all priorities, including the need for “…follow-up tasks that provide best-practice tools and resources…” ([15], p. 25). The outcome of this exercise was the conclusion that the incorporation of DFE into product design and manufacturing is indeed important (refer to pages 4-5 of the 1994 Roadmap for a list of priority needs). In order to move forward on this need, a task team was assembled 7 to examine the pervasiveness of DFE in the industry and to list desirable DFE tool characteristics. By means of a survey created by the task team and individual interviews of industry representatives, the 1996 Roadmap is attempting to: 1) begin the process of defining the state of evolution of DFE in the electronics industry, 2) identify the type of tools that facilitate the application of DFE principles in design and manufacturing, and 3) recognize the potential mismatch between design tool needs and tool availability. Survey participants were selected from a range of product domains in the electronics industry and represent varied design experience. The vast majority currently design, or have designed, at one or more of the following levels: semiconductor/integrated circuit, multichip module, printed wiring board, board assembly, sub-system, and system. It should be noted that the participants recommended by the task group (approximately 80% of the participants) were already somewhat familiar with the concepts, if not specific practices, of DFE. 7 Task team members (in alphabetical order) were: Dave Allen (University of Texas at Austin, co-leader); Barry Dambach (AT&T); Joseph Fiksel (Decision Focus); Tom Fletcher (Honeywell Microswitch); Gary Halada (State University of New York Stoneybrook); Paul Iyer (Hughes Electronics); Gary Kirchner (Honeywell); David Ufford (Texas Instruments); and Colleen Wilson (MCC, co-leader). 54
Design for Environment: Evolution and Tool Needs 4.3 Findings As stated earlier, the value of a given type of tool will depend, at least partly, on the state of DFE integration in an organization. The survey was designed to focus on features of software tools, based on the belief that a number of companies had reached a level with DFE practices that called for rather sophisticated techniques. It was found that half of the 16 respondents currently use some type of DFE tool, ranging from relatively simple information resources to more complex, software-based products. The most common tools include: checklists, design standards, design guides, and databases on chemicals and materials. In some cases, the DFE process was facilitated by drawing upon groups in the company with specialized knowledge in materials and environmental science. Interviews that followed the survey provided valuable insight into the current state of DFE evolution and revealed the need for relatively simple tools. The interviews also provided background on where the company stands with DFE: general acceptance of the concepts; the range of (typically non-software) tools used; and drivers to, success with, and obstacles facing the integration of DFE principles into the organization. 4.3.1 Surveys: Brief Summary of Tool-Feature Ranking Tool features in this survey fall into six categories: Human Interface, Connectivity, Functionality, Scope, General Compatibility, and Environmental Results Generated. Participants were asked to compare the importance of features within a single category (not across the categories). Given the small sample size of this survey, no statistical analysis was attempted. 8 However, by simply ranking tool features as a High (three points), Medium (two points), or Low (one point) priority, it becomes clear that certain software-based tool features are perceived as critical to a successful DFE program (please refer to Appendix F for a full survey, with rankings). Those tool features receiving top ranking from each of the six categories are: Human Interface: Tool comes with databases of environmental information; Connectivity: Tool is fully integrated with computer-aided engineering/design (CAE/CAD) platforms or existing design tool suite; Functionality: Tool supports technology tradeoff studies (performance feedback of various technologies/materials; recommendations of alternatives/potential solutions/substitute technologies) in real time and tool provides environmental regulations, compliance, and environmental policies and procedures (both features tied for top ranking in this category); Scope: Tool is applicable to various areas of electronics manufacturing (packaging and interconnect, discrete components, PWBs, etc.) 8 The following individuals participated in the survey, the interview, or both: Fred Earnst (Honeywell); Tom Fletcher (Honeywell); Tim Glahn (E-Systems); Marc Heyns (IMEC, Belgium); Tim Mann (IBM); Ed Johnson (Raychem); Bahiru Kassahun (AT&T); Cavan Kelsey (Eastman Kodak); Leo Klerks (Philips Semiconductors); Dennis Kodimer (Honeywell); Matthew Lukaszewski (Pitney Bowes); Markku Makkonen (Nokia, Finland); Herbert Reichl (IZM, Germany); Mike Sampson (Sampson Engineering); Paul Sheng (UC Berkeley); Joyce Smith (graduate student, Duke University); and an anonymous participant. 55
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
Page 21 and 22: Introduction These kinds of cross-c
Page 23 and 24: Introduction Strategic Priority Nee
Page 25 and 26: Introduction Tactical Priority Need
Page 27 and 28: 2.0 Strategic Business Opportunitie
Page 29 and 30: Strategic Business Opportunities To
Page 31 and 32: Strategic Business Opportunities Go
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Page 35 and 36: Strategic Business Opportunities Th
Page 37 and 38: Strategic Business Opportunities -
Page 39 and 40: Environmental Cost Accounting at AT
Page 41 and 42: Strategic Business Opportunities Pr
Page 43 and 44: Strategic Business Opportunities sm
Page 45 and 46: Strategic Business Opportunities pr
Page 47 and 48: Strategic Business Opportunities en
Page 49: Priority Need Task 1. Knowledge of
Page 52 and 53: Information and Knowledge Systems m
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Page 58 and 59: Information and Knowledge Systems 4
Page 60 and 61: Information and Knowledge Systems A
Page 64 and 65: Information and Knowledge Systems m
Page 69 and 70: Design for Environment: Evolution a
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Page 79 and 80: 5. Models to support more comprehen
Page 81 and 82: 5.0 Disposition Disposition 5.1 Obj
Page 83 and 84: Disposition due date are called con
Page 85 and 86: Disposition 5.4.1 The Consumer/Comm
Page 87 and 88: Disposition 5.4.2 Recycled Material
Page 89 and 90: Disposition One of the greatest cha
Page 91 and 92: Disposition Assistance (OEA) submit
Page 93 and 94: Disposition provision in other inst
Page 95 and 96: Disposition The proposals strongly
Page 97 and 98: 5.5.5 Summary: Lessons from Program
Page 99 and 100: Disposition The left side of the mo
Page 101 and 102: Disposition and government for esta
Page 103 and 104: Disposition Recycling: The collecti
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Page 108 and 109: Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
Page 114 and 115: Emerging Technologies Therefore, gi
Page 116 and 117: Emerging Technologies Printed Wirin
Page 118 and 119: Emerging Technologies 100 ensures f
Page 120 and 121: Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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