1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix A OIDA Key markets are long distance telecommunications, shorter distance communications, high performance data communications, and low cost data communications. Key concerns include developing manufacturing technologies to allow high performance opto-electronic components to be made less expensively and developing the inherently low cost opto-electronics from consumer and industrial sectors into high performance technologies for a broad range of computer and communications sector applications. (continued) OIDA Recommended efforts include automated passive assembly and precision alignment; opto-electronic package platforms that could accommodate both optical and high speed electronic requirements; CAD/simulation tools to speed system engineering or package devices; wafer processing equipment for both InP and GaAs-based technology; in situ monitoring and control; and flexible batch processing. Optical Storage Encompasses a wide-range of products, media, and applications, ranging from compact discs to rewriteable magneto-optic drives used in work stations to optical disk libraries. Key issues: Green, blue, and shorter wavelength lasers and low cost manufacturable substrate and media technologies plus complete optical recording systems that exploit both the lasers and the media. Hardcopy Relates to the technology to support printing and copying image from electronic files onto paper, plastic, metal, film or other materials. Key issue: need for a single color standard to support all color scanning, display, and hardcopy. Need for high power, low cost UV lasers and special materials for solid imaging. Should include research on photopolymers, powder technology to produce full density plastic parts, an inert high temperature materials to be used in systems which directly deposit molten metals to form objects. Roadmap also suggests work in improving inkjet technology and other generic technologies to support improved print technologies. DFE/DFM/CAD/CAM, Rapid Prototyping, Simulation 138
Appendix A SIA/SEMATECH In a steady state basis, a linked set of CAD tools is needed to interpret a chip factory’s technology performance and evolve its process design for improved yield. Design of new generations requires the added capability of predicting performance, reliability, and yield. These tools must cover a wide spectrum of technologies, be robust, be calibrated easily by the end user, and allow for routine technical support without the intervention of an expert user. The roadmap includes a list of the sixteen top CAD priorities (Table 7), several of which potentially have some environmental implementation (i.e., defect-mediated dopant profile evolution, silicidation models). Modeling And Simulation There will not be radical changes in the process technology used to manufacture semiconductors throughout this decade. Rather, there will be expansion and refinement of current processes. Current modeling tools are isolated, sporadically used, seldom reused, and lack a common application plan or strategy. Solving the problem requires fostering a unified modeling team effort that is cognizant of the full spectrum of modeling required to capture the manufacturing and business environment. A coherent modeling architecture, effective partnering with manufacturers, suppliers, universities, and national laboratories, and compatibility with industry standard systems. (continued) 139
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Page 108 and 109: Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
Page 114 and 115: Emerging Technologies Therefore, gi
Page 116 and 117: Emerging Technologies Printed Wirin
Page 118 and 119: Emerging Technologies 100 ensures f
Page 120 and 121: Emerging Technologies Etch Chemical
Page 122 and 123: Emerging Technologies 104 Fully Sub
Page 124 and 125: Emerging Technologies adhesives and
Page 126 and 127: Emerging Technologies 108 have sign
Page 128 and 129: Emerging Technologies 110 of automa
Page 130 and 131: Emerging Technologies 112 managemen
Page 132 and 133: Emerging Technologies 6.4.4 Fully A
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
Page 151 and 152: Appendix A IPC “The coordination
Page 153 and 154: Appendix A OIDA Specific technical
Page 155: Appendix A NEMI Photonics Critical
Page 159 and 160: Appendix A SIA/SEMATECH Hand-in-han
Page 161 and 162: Appendix A SIA/SEMATECH Chemical, e
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
Page 167 and 168: SIA/SEMATECH Benchmarking NEMI Need
Page 169 and 170: Appendix A IPC Purchasing Suppliers
Page 171 and 172: Appendix B. The Ten Ceres Principle
Page 173 and 174: Appendix C. The ICC Business Charte
Page 175 and 176: Appendix D Appendix D. Statistical
Page 177 and 178: SIC CODE Table 1. Demographic and w
Page 179 and 180: Appendix D Table 2. Correlation of
Page 181 and 182: SIC Code Table 3. Costs of fuels an
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Page 185 and 186: 1 Value of shipments for product by
Page 187 and 188: 3676- Electronic resistors 3677- El
Page 189 and 190: Appendix D Product Product Company
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Page 203 and 204: Appendix D Table 9. Quantity and va
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Appendix D Product Product Company
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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