1996 Electronics Industry Environmental Roadmap - Civil and ...

More documents

Recommendations

Info

Appendix A NEMI Stresses the importance of integrated manufacturing information and management systems Advanced modeling and simulation will be an essential part of the MIMS Emphasizes integration from design to delivery There is a need for manufacturing metrics (continued) NEMI Additionally, the manufacturing information system was thought of as the hardware/software infrastructure used to gather critical manufacturing data and transmit operating instruction to the diverse parts of the manufacturing system. Over time, the MIS role has expanded to include management-related functions at the shop floor level such as work-in-process (WIP) management and tracking, process control and quality management. Also discussed are manufacturing management systems (MMS), including materials and resource planning systems (MRP) and CIM technology. The MIMS will include and integrate such functions as data acquisition from and communication with all parts of the manufacturing enterprise; scheduling and route building; intelligent capacity planning, including cost performance modeling and simulation; raw materials, WIP, and inventory management; process control and quality management; facility and equipment maintenance; and management of the design manufacturing interface. Technology development includes new forms of interface, intelligent maintenance and scheduling systems, beta integration, and others. IPC Information Systems (CIM/MIS) Potential paradigm shifts highlighted by the roadmap include seamless data transfer, electronic verification, global parts libraries, and manufacturing assembly cost analyses. The IPC’s recommendation focuses on the development of a global parts library, including features such as mechanical, physical, environmental, thermal, electrical performance, special handling requirements for moisture/reflow/thermal-sensitive or high pin count parts. This library should be accessible via the worldwide web and routinely be updated by component package standard bodies to include new part descriptions. OIDA ES&H 142
Appendix A SIA/SEMATECH Chemical, energy and water mass balance will support reducing chemicals and effluent, and sizing facility exhaust and waste handling systems. Cost of ownership includes the purchase, use management, disposal and liability costs Some progress beyond the 0.5mm technology level is being made in hazardous chemical use reduction, reduced emissions, and tool and factory mass balance. Very little progress has been made beyond the 0.5 mm technology level with regard to CoO, hazardous chemical risk assessment, and ergonomics. Significant progress is being made in reducing the use of hazardous chemicals. Ozone-depleting substances and targeted glycol ethers are rapidly disappearing from semiconductor wafer manufacturing and assembly processes. (continued) SIA/SEMATECH Alternative chemicals and safer delivery methods are being sought for silane, dopants, and hazardous solvents and degreasers used in equipment cleaning and product assembly processes. Emission abatement technology, process optimization, and replacement chemicals are needed for atmospherically long-lived process gases, such as perfluoro compounds. Advanced wafer cleaning methods that use either significantly less chemicals or none at all have been demonstrated, although much research is still needed. Room for significant improvement in energy consumption per m2 of silicon wafer processed. Efficient use of water in processes and cost-effective recycling of ultrapure water in facilities are strategic needs that require more emphasis. Calls for move to additive processes by 2010 Key environmental safety and health requirements in materials involve processes include improved handling of hazardous materials, alternatives to hazardous materials, waste stream minimization or abatement, selective deposition processes, point-of-use chemical generation, water recycling, improved ergonomic design of equipment, process material minimization, and chemical reprocessing. 143
Page 1 and 2:
MCC TECHNICAL REPORT MCC-ECESM-001-
Page 3 and 4:
MCC Technical Report Document No. M
Page 5 and 6:
Table of Contents Electronics Indus
Page 7 and 8:
Electronics Industry Environmental
Page 9:
Page 12 and 13:
Page 15 and 16:
Executive Summary Electronics Indus
Page 17 and 18:
Page 19 and 20:
1.0 Introduction Introduction 1.1 O
Page 21 and 22:
Introduction These kinds of cross-c
Page 23 and 24:
Introduction Strategic Priority Nee
Page 25 and 26:
Introduction Tactical Priority Need
Page 27 and 28:
2.0 Strategic Business Opportunitie
Page 29 and 30:
Strategic Business Opportunities To
Page 31 and 32:
Strategic Business Opportunities Go
Page 33 and 34:
Strategic Business Opportunities co
Page 35 and 36:
Strategic Business Opportunities Th
Page 37 and 38:
Strategic Business Opportunities -
Page 39 and 40:
Environmental Cost Accounting at AT
Page 41 and 42:
Strategic Business Opportunities Pr
Page 43 and 44:
Strategic Business Opportunities sm
Page 45 and 46:
Strategic Business Opportunities pr
Page 47 and 48:
Strategic Business Opportunities en
Page 49:
Priority Need Task 1. Knowledge of
Page 52 and 53:
Information and Knowledge Systems m
Page 54 and 55:
Information and Knowledge Systems T
Page 56 and 57:
Information and Knowledge Systems T
Page 58 and 59:
Information and Knowledge Systems 4
Page 60 and 61:
Information and Knowledge Systems A
Page 62 and 63:
Page 64 and 65:
Information and Knowledge Systems m
Page 66 and 67:
Page 69 and 70:
Design for Environment: Evolution a
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
5. Models to support more comprehen
Page 81 and 82:
5.0 Disposition Disposition 5.1 Obj
Page 83 and 84:
Disposition due date are called con
Page 85 and 86:
Disposition 5.4.1 The Consumer/Comm
Page 87 and 88:
Disposition 5.4.2 Recycled Material
Page 89 and 90:
Disposition One of the greatest cha
Page 91 and 92:
Disposition Assistance (OEA) submit
Page 93 and 94:
Disposition provision in other inst
Page 95 and 96:
Disposition The proposals strongly
Page 97 and 98:
5.5.5 Summary: Lessons from Program
Page 99 and 100:
Disposition The left side of the mo
Page 101 and 102:
Disposition and government for esta
Page 103 and 104:
Disposition Recycling: The collecti
Page 105:
Disposition 87
Page 108 and 109:
Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
Page 114 and 115: Emerging Technologies Therefore, gi
Page 116 and 117: Emerging Technologies Printed Wirin
Page 118 and 119: Emerging Technologies 100 ensures f
Page 120 and 121: Emerging Technologies Etch Chemical
Page 122 and 123: Emerging Technologies 104 Fully Sub
Page 124 and 125: Emerging Technologies adhesives and
Page 126 and 127: Emerging Technologies 108 have sign
Page 128 and 129: Emerging Technologies 110 of automa
Page 130 and 131: Emerging Technologies 112 managemen
Page 132 and 133: Emerging Technologies 6.4.4 Fully A
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
Page 151 and 152: Appendix A IPC “The coordination
Page 153 and 154: Appendix A OIDA Specific technical
Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
Page 159: Appendix A SIA/SEMATECH Hand-in-han
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
Page 167 and 168: SIA/SEMATECH Benchmarking NEMI Need
Page 169 and 170: Appendix A IPC Purchasing Suppliers
Page 171 and 172: Appendix B. The Ten Ceres Principle
Page 173 and 174: Appendix C. The ICC Business Charte
Page 175 and 176: Appendix D Appendix D. Statistical
Page 177 and 178: SIC CODE Table 1. Demographic and w
Page 179 and 180: Appendix D Table 2. Correlation of
Page 181 and 182: SIC Code Table 3. Costs of fuels an
Page 183 and 184: 3672 Printed Circuit Boards 3674 Se
Page 185 and 186: 1 Value of shipments for product by
Page 187 and 188: 3676- Electronic resistors 3677- El
Page 189 and 190: Appendix D Product Product Company
Page 201 and 202: Appendix D 183
Page 203 and 204: Appendix D Table 9. Quantity and va
Page 209 and 210: Key to Table 9: - Represents zero.
Page 211 and 212:
SIC Code 36 361 Table 10. Air pollu
Page 213 and 214:
SIC Code 36 361 362 Table 11. Pollu
Page 215 and 216:
SIC Code 36 Appendix D Table 12. Po
Page 217 and 218:
Appendix E Appendix E. Development
Page 219 and 220:
Appendix E releases with component
Page 221 and 222:
Appendix E 2 1 ITEM: Common Sense I
Page 223 and 224:
Appendix E 6 1 ITEM: U.S. Industria
Page 225 and 226:
Appendix E 1 ITEM: Waste Wi$e 2 SOU
Page 227 and 228:
Appendix E 14 1 ITEM: 33/50 Program
Page 229 and 230:
Appendix E 3 CONTENT: This Departme
Page 231 and 232:
Appendix E clearinghouses, database
Page 233 and 234:
5 COST: Free access to all data/inf
Page 235 and 236:
Appendix E 34 1 ITEM: EMPF (Electro
Page 237 and 238:
Appendix E 37 1 ITEM: I3LA (Initiat
Page 239 and 240:
Appendix E 40 1 ITEM: Access EPA 2
Page 241 and 242:
Appendix E 7 PERTINENCE: Probably n
Page 243 and 244:
Appendix E 3 CONTENT: Large indexed
Page 245 and 246:
Appendix E 55 1 ITEM: UCLA Center f
Page 247 and 248:
Item # Type Source of Item Access C
Page 249 and 250:
Appendix F. Survey of Tool Characte
Page 251 and 252:
[Definitions for the design activit
Page 253 and 254:
Human Interface (Please rank the im
Page 255 and 256:
Appendix F 5 Quantifies and reports
Page 257 and 258:
Appendix G Appendix G. Building Blo
Page 259 and 260:
Appendix G The Nordic cooperation g
Page 261:
Appendix G undertaken to assess env
Page 264 and 265:
Appendix H If no accrual is made be
Page 266 and 267:
Appendix H 248
Page 268 and 269:
Appendix I 250
Page 270 and 271:
Appendix J The ordinance requires U
Page 272 and 273:
Appendix J 254 150,001 to 600,000 1
Page 274 and 275:
Appendix J Germany (Proposed; effec
Page 276 and 277:
References [16] Waitz and Corbet,
Page 278:
References 260
show all

1996 Electronics Industry Environmental Roadmap - Civil and ...

Create successful ePaper yourself

Delete template?

Save as template?