1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix F Within each of the following categories (Human Interface, Connectivity, Functionality, Scope, General Compatibility, and Environmental Results Generated), please rank the characteristics according to their relative importance to the DFE (design-for-environment) process. 234
Human Interface (Please rank the importance of the features below as Low, Med, or High) 2 Allows user to enter data, update information, etc. 1 Tool comes with databases of environmental information 5 Able to present information in the form of visual charts and graphs 6 Offers graphical point and click interface 3 Has flexible report-generation capability 5 Provides on-line help 4 Is user maintainable (versus requiring a system administrator) Other: ____________________________________________________________ Appendix F Connectivity (Please rank the importance of the features below as Low, Med, or High) 1 Fully integrated with CAE/CAD platforms or existing design tool suite 2 Compatible with multiple platforms (please underline the most useful platform(s): PC, Mac, Mainframe, other: 7 Linked to World Wide Web 4 Capable of ready access to information from other non-environmental databases and design tools (inventory, factory components/parts, materials lists, process data, purchasing data; etc.) 6 Interfaces with project documentation software 8 Interfaces with project scheduling methods/software 3 Linked to existing material use and inventory databases at your facility 5 Is able to integrate seamlessly into time-to-market product design Other: ____________________________________________________________ Functionality (Please rank the importance of the features below as Low, Med, or High) 5 Provides cost/benefit and economic impact analysis for lifetime of the product 3 Provides benchmarking capabilities for comparison 1 Supports technology tradeoff studies (performance feedback of various technologies, materials; recommendations of alternatives/potential solutions/substitute technologies) in real time 7 Captures design history of materials, processes, etc. 6 Able to trace requirements through a functional or structural hierarchy 235
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Page 211 and 212: SIC Code 36 361 Table 10. Air pollu
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Page 217 and 218: Appendix E Appendix E. Development
Page 219 and 220: Appendix E releases with component
Page 221 and 222: Appendix E 2 1 ITEM: Common Sense I
Page 223 and 224: Appendix E 6 1 ITEM: U.S. Industria
Page 225 and 226: Appendix E 1 ITEM: Waste Wi$e 2 SOU
Page 227 and 228: Appendix E 14 1 ITEM: 33/50 Program
Page 229 and 230: Appendix E 3 CONTENT: This Departme
Page 231 and 232: Appendix E clearinghouses, database
Page 233 and 234: 5 COST: Free access to all data/inf
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Page 237 and 238: Appendix E 37 1 ITEM: I3LA (Initiat
Page 239 and 240: Appendix E 40 1 ITEM: Access EPA 2
Page 241 and 242: Appendix E 7 PERTINENCE: Probably n
Page 243 and 244: Appendix E 3 CONTENT: Large indexed
Page 245 and 246: Appendix E 55 1 ITEM: UCLA Center f
Page 247 and 248: Item # Type Source of Item Access C
Page 249 and 250: Appendix F. Survey of Tool Characte
Page 251: [Definitions for the design activit
Page 255 and 256: Appendix F 5 Quantifies and reports
Page 257 and 258: Appendix G Appendix G. Building Blo
Page 259 and 260: Appendix G The Nordic cooperation g
Page 261: Appendix G undertaken to assess env
Page 264 and 265: Appendix H If no accrual is made be
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Page 268 and 269: Appendix I 250
Page 270 and 271: Appendix J The ordinance requires U
Page 272 and 273: Appendix J 254 150,001 to 600,000 1
Page 274 and 275: Appendix J Germany (Proposed; effec
Page 276 and 277: References [16] Waitz and Corbet,
Page 278: References 260
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