1996 Electronics Industry Environmental Roadmap - Civil and ...

Appendix A
SIA/SEMATECH Hand-in-hand with the need to master the complexity challenge comes
the need to deal with the power dissipation problem. Techniques and
tools are needed for improved power minimization, distribution and
management, as well as maintaining signal integrity in the face of high
clock rates, low supply voltages, and the need to accommodate mixed
signal circuitry.
Also, as a direct result of the complexity explosion, the need for test
minimization which maintaining product quality requires
improvements in modeling defects and fault-for-test.
Need for shift from point-tools to top down design.
Need for benchmarks
Need for rapid acceptance of standards
From a testing standpoint, the roadmap concludes there is a need for a
large scale shift from external vector testing to on-chip BIST, serialscan
testing, and DFT.
NEMI Key issues are design tool and prototyping tool interoperability,
enterprise connectivity for knowledge assimilation and sharing, and
electronic commerce.
Core competencies include modeling and simulation, technology
integration (including materials, electronics, optics, computers and
others); validation/verification; advanced computing.
Development of these technologies is proposed within a context of
“factories of the future” along with focused programs and virtual
prototyping and rapid physical prototyping. Key emphasis is also in
interoperable prototyping tools and databases.
Key issues virtual prototyping, lot size one, special rapid prototyping
techniques, enterprise connectivity, and concurrent culture.
IPC
OIDA
Manufacturing Information and Management Systems
SIA/SEMATECH Refers to information technologies that describe and implement the
overall structure and behavior of semiconductor factories.
The fundamental change is to drive the development and adoption of
standards to realize manufacturing systems based on a common
framework.
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