1996 Electronics Industry Environmental Roadmap - Civil and ...

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Emerging Technologies Printed Wiring Boards: Printed wiring boards (PWBs) represent the dominant interconnect technology on which chips will be attached and represents another key opportunity for making significant environmental advances. According to NEMI [33]: 98 “The challenges of lowering costs and improving interconnect density while becoming more environmentally benign are best solved through the development of new materials and improved manufacturing processes. A method must be found to restore significant research and development capability to the industry.” There are several types of PWBs. They may be rigid, generally made of a glass-reinforced epoxy-resin laminate, or flexible, generally made of polyimide and polyester substrates. Printed wiring boards may be either single- or double-sided, or may have multiple layers. PWB production is a complex process requiring many individual steps to complete the board. Regardless of the type of PWB, common processes include drilling, image transfer, and electroplating [34]. Base Material: The base material for most PWB fabrication processes is a copper-foilclad resin/glass composite. A woven cloth (typically made of glass fiber) is impregnated with a plastic resin (usually an epoxy) and both surfaces of the impregnated cloth are then covered with a copper foil. The base material is purchased by the PWB manufacturer as a starting material for the overall circuit board process described below.
Emerging Technologies Innerlayer Fabrication: The base material is received from a supplier and cleaned, after which photoresist films are applied to both surfaces. The photoresist films are imaged by shining light through a photomask, selectively exposing photoresist. Those areas of photoresist exposed to the light are developed out to leave copper foil not needed for conductor patterns exposed. A chemical etch is performed next to remove unwanted areas of copper, at which point circuit board traces remain on the innerlayer surfaces. Resist, used to mask the copper during etch, is next stripped chemically. If the patterned innerlayer is to be combined with other layers as described below, a final chemical treatment of the exposed/ patterned copper is performed to enhance adhesion to other layers in subsequent steps. Innerlayer fabrication is really the process of creating a double-sided circuit board with patterned conductors on both top and bottom of the base material. For certain applications, such a double-sided board represents a completed PWB, but in most cases, it is combined with other layers to form a complete PWB. Figure 6-2 illustrates the innerlayer manufacturing process, an important building block for circuit board manufacturing. Resist coat and pattern undrilled laminate Etch Cu Strip resist Figure 6-2. Multilayer PC board innerlayer fabrication. Lamination: Multiple innerlayers typically are combined together as part of forming a multilayer PCB. Lamination is the process by which these innerlayers are joined. During lamination, innerlayers are stacked together with a glue layer between them. The glue layers are often simply base material (impregnated glass cloth) without the copper foils on the surface. The innerlayers, the glue layer separators, and typically a copper foil layer on top and bottom are then placed under heat and pressure to create a single multilayer circuit card ready for further processing. Drilling/Desmear: To create connections between the multiple layers in the PWB, holes are drilled through the laminated stack. These holes will form the basis for conductive paths through the PWB. Prior to plating the holes a desmear process is necessary to remove epoxy residue adhered to the walls of the drilled holes. The desmear process 99
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems 4
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Information and Knowledge Systems m
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Page 69 and 70: Design for Environment: Evolution a
Page 79 and 80: 5. Models to support more comprehen
Page 81 and 82: 5.0 Disposition Disposition 5.1 Obj
Page 83 and 84: Disposition due date are called con
Page 85 and 86: Disposition 5.4.1 The Consumer/Comm
Page 87 and 88: Disposition 5.4.2 Recycled Material
Page 89 and 90: Disposition One of the greatest cha
Page 91 and 92: Disposition Assistance (OEA) submit
Page 93 and 94: Disposition provision in other inst
Page 95 and 96: Disposition The proposals strongly
Page 97 and 98: 5.5.5 Summary: Lessons from Program
Page 99 and 100: Disposition The left side of the mo
Page 101 and 102: Disposition and government for esta
Page 103 and 104: Disposition Recycling: The collecti
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Page 108 and 109: Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
Page 114 and 115: Emerging Technologies Therefore, gi
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Page 120 and 121: Emerging Technologies Etch Chemical
Page 122 and 123: Emerging Technologies 104 Fully Sub
Page 124 and 125: Emerging Technologies adhesives and
Page 126 and 127: Emerging Technologies 108 have sign
Page 128 and 129: Emerging Technologies 110 of automa
Page 130 and 131: Emerging Technologies 112 managemen
Page 132 and 133: Emerging Technologies 6.4.4 Fully A
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
Page 151 and 152: Appendix A IPC “The coordination
Page 153 and 154: Appendix A OIDA Specific technical
Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
Page 159 and 160: Appendix A SIA/SEMATECH Hand-in-han
Page 161 and 162: Appendix A SIA/SEMATECH Chemical, e
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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