1996 Electronics Industry Environmental Roadmap - Civil and ...

Appendix A
SIA/SEMATECH Chemical, energy and water mass balance will support reducing chemicals
and effluent, and sizing facility exhaust and waste handling
systems.
Cost of ownership includes the purchase, use management, disposal
and liability costs
Some progress beyond the 0.5mm technology level is being made in
hazardous chemical use reduction, reduced emissions, and tool and
factory mass balance. Very little progress has been made beyond the
0.5 mm technology level with regard to CoO, hazardous chemical risk
assessment, and ergonomics.
Significant progress is being made in reducing the use of hazardous
chemicals. Ozone-depleting substances and targeted glycol ethers are
rapidly disappearing from semiconductor wafer manufacturing and
assembly processes.
(continued)
SIA/SEMATECH Alternative chemicals and safer delivery methods are being sought for
silane, dopants, and hazardous solvents and degreasers used in
equipment cleaning and product assembly processes.
Emission abatement technology, process optimization, and
replacement chemicals are needed for atmospherically long-lived
process gases, such as perfluoro compounds.
Advanced wafer cleaning methods that use either significantly less
chemicals or none at all have been demonstrated, although much
research is still needed.
Room for significant improvement in energy consumption per m2 of
silicon wafer processed.
Efficient use of water in processes and cost-effective recycling of
ultrapure water in facilities are strategic needs that require more
emphasis.
Calls for move to additive processes by 2010
Key environmental safety and health requirements in materials involve
processes include improved handling of hazardous materials,
alternatives to hazardous materials, waste stream minimization or
abatement, selective deposition processes, point-of-use chemical
generation, water recycling, improved ergonomic design of equipment,
process material minimization, and chemical reprocessing.
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