1996 Electronics Industry Environmental Roadmap - Civil and ...

Appendix A
NEMI Integrate the enterprise from design to delivery.
Improve software research for industry.
Improve computer-assisted decision support.
Development of intelligence sensors and actuators - in many cases it is
impossible to capture, transmit, and act on needed information because
the sensor-actuated technology does not exist or is not affordable.
(continued)
NEMI Develop a MIMS capability that supports the use of so-called business
rules that allows the user to tune the factory’s behavior in response to
current conditions with little or no reprogramming.
The roadmap also calls for centers of modeling excellence,
development of appropriate standards to support MIMS technology,
leveraging the factory integration roadmap, and building on national
information infrastructure, and education and training for factory
management
Three-dimensional imaging will become a critical technology to
electronics assembly as current trends in miniaturization continue.
Examples where 3-D imaging is currently being attempted include
scanning solder-paced profiles for correct volume distribution and
determining the coplanarity of surface mount device leads.
Thermal imaging offers opportunities in electronic process control. An
example is control into solder reflow process. Thermal imaging would
allow automatic sensing of thermal distributions and finer control of
heating elements.
Among other options, the roadmap notes that environmental
restoration and waste management activities within DoD and DoE
have developed significant technical programs focused on sensors
required to complete activities. ER and WM detectors/monitors use a
chemically sensitive transduction mechanism that enables the sensor to
select the chemical/gases of interest.
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