1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix F IV. Additional Comments Please use the space below for additional comments on DFE tool characteristics, tool usage, tools you are aware of (but don’t necessarily use), thoughts and ideas that came to you as you read through the survey, etc. ______________________________________________________________________________ ______________________________________________________________________________ ______________________________________________________________________________ ______________________________________________________________________________ ______________________________________________________________________________ 238
Appendix G Appendix G. Building Blocks for Environmental Tradeoff Assessments to Support DFE—A Sample of European Projects Increasing pressure for more environmentally conscious processes and products comes in a variety of forms: legislation, eco-labeling, environmental auditing, and customer requirements, for example. 20 Each of these drivers will likely require that materials and processes be assessed. These assessments may either ensure that the best known options are being exercised, or point to some needed changes in materials and/or manufacturing processes. The search for alternative materials or processes is usually complicated. It is often simpler to determine what not to use than it is to weigh alternatives, each of which might be legally and technically viable, but which may have undesirable environmental consequences. As discussed in Chapter 4, many companies are at the stage of discovering how to measure the tradeoffs for design for the environment (DFE)—determining what metrics to use in their assessments. A critical element for the decisions that results from such analyses is qualitative data, which is often not readily available. In some cases, companies may be facing tasks for which there is little support or infrastructure. This appendix will present examples of activities in Europe that are providing support for the infrastructure necessary for environmental assessments. The goal of this section is not to present the findings, or evaluate the quality, of the studies. Rather, it is to briefly describe four efforts— three in Scandinavia and one Belgium—that provide the electronics industry with the type of information necessary for eventual DFE-based practices. Danish Environmental Protection Agency The Danish Environmental Protection Agency (DEPA) financed a joint research project to investigate environmentally problematic substances and materials in electronic equipment. As part of the “Cleaner Technology and Products” national program, the DEPA and the Danish Electronics Industry Association cooperated to provide quantitative data that would enable component selections based on environmental impact. The DEPA hopes that the resulting inventory data will better enable optimal disposition decisions for electronic equipment and that the tool will simplify the environmental impact assessments of materials used in electronic components. 21 An important issue that came out of the study was the need for improved communication and data transfer between materials and component suppliers and the electronic product manufacturer. The project had four technical phases: preliminary investigation, component analyses, environmental specifications, and product materials flow analyses. Researchers concentrated on passive 20 In Europe, a variety of drivers already exist: EC Directive on Environmental Impact Assessment, (EIA, Official Journal 1985 L 175, pg. 40), Draft Directive on Integrated Pollution Prevention and Control (OJ 1993 C 311/6); EC Ecolabelling Scheme (OJ 1992 L 99/1); EC Eco-Management and Audit Regulation (OJ 1993 L 168/1); EC Directive on Packaging and Packaging Waste (OJ 1994 365/10); and the German Law on Recycling and Waste (Kr-/AbfG; BGB1, 1994 I/2705) to be implemented in 1996. 21 The study findings are available in four different reports, some in Danish and some in English. For information on the reports, contact the Ministry of Environment and Energy, Danish Environmental Protection Agency, Tel: 45 32 66 01 00. Reference the Miljoprojekt nr. 289, 1995. 239
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Page 231 and 232: Appendix E clearinghouses, database
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Page 239 and 240: Appendix E 40 1 ITEM: Access EPA 2
Page 241 and 242: Appendix E 7 PERTINENCE: Probably n
Page 243 and 244: Appendix E 3 CONTENT: Large indexed
Page 245 and 246: Appendix E 55 1 ITEM: UCLA Center f
Page 247 and 248: Item # Type Source of Item Access C
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Page 255: Appendix F 5 Quantifies and reports
Page 259 and 260: Appendix G The Nordic cooperation g
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Page 264 and 265: Appendix H If no accrual is made be
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Page 268 and 269: Appendix I 250
Page 270 and 271: Appendix J The ordinance requires U
Page 272 and 273: Appendix J 254 150,001 to 600,000 1
Page 274 and 275: Appendix J Germany (Proposed; effec
Page 276 and 277: References [16] Waitz and Corbet,
Page 278: References 260
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