1996 Electronics Industry Environmental Roadmap - Civil and ...

Emerging Technologies
94
Planarization Solid/liquid/gaseous waste depending on process
Dielectric deposition and etch Gaseous waste
Cleaning (used between many steps) Liquid and gaseous waste stream, especially
sulfuric acid and water
General facilities Energy consumption for lighting, air conditioning
and air handling
Table 6-1. Environmental impact of some common semiconductor manufacturing processes.
Wafer size continues to increase from the present 150 to 200 mm and with larger wafers will
come smaller feature sizes and finer line widths. This growing complexity leads to an increased
requirement for photomasks, with SIA projecting that the minimum mask count will grow from
eighteen today to twenty-four or more by the year 2010. Additional metallization layers will also
be required to manage the increased complexity. As pointed out by the SIA roadmap [31]:
“With each generation of logic products and microprocessors, the capability to
fabricate more devices in silicon exceeds the ability to wire them. This results in
a dramatic increase in the number of metal levels.”