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1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix A<br />

SIA/SEMATECH In a steady state basis, a linked set of CAD tools is needed to interpret<br />

a chip factory’s technology performance <strong>and</strong> evolve its process design<br />

for improved yield. Design of new generations requires the added<br />

capability of predicting performance, reliability, <strong>and</strong> yield. These tools<br />

must cover a wide spectrum of technologies, be robust, be calibrated<br />

easily by the end user, <strong>and</strong> allow for routine technical support without<br />

the intervention of an expert user.<br />

The roadmap includes a list of the sixteen top CAD priorities (Table<br />

7), several of which potentially have some environmental<br />

implementation (i.e., defect-mediated dopant profile evolution,<br />

silicidation models).<br />

Modeling And Simulation<br />

There will not be radical changes in the process technology used to<br />

manufacture semiconductors throughout this decade. Rather, there will<br />

be expansion <strong>and</strong> refinement of current processes.<br />

Current modeling tools are isolated, sporadically used, seldom reused,<br />

<strong>and</strong> lack a common application plan or strategy.<br />

Solving the problem requires fostering a unified modeling team effort<br />

that is cognizant of the full spectrum of modeling required to capture<br />

the manufacturing <strong>and</strong> business environment. A coherent modeling<br />

architecture, effective partnering with manufacturers, suppliers,<br />

universities, <strong>and</strong> national laboratories, <strong>and</strong> compatibility with industry<br />

st<strong>and</strong>ard systems.<br />

(continued)<br />

139

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