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Introduction to Nanotechnology

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6.1. SOLID DISORDERED NANOSTRUCTURES 151<br />

This silicon is called porous silicon (PoSi). By controlling the processing conditions,<br />

pores of nanometer dimensions can be made. Research interest in porous silicon was<br />

intensified in 1990 when it was discovered that it was fluorescent at room tem-<br />

perature. Luminescence refers <strong>to</strong> the absorption of energy by matter, and its re-<br />

emission as visible or near-visible light. If the emission occurs within lops s of the<br />

excitation, then the process is calledjuorescence, and if there is a delay in the<br />

emission it is called phosphorescence. Nonporous silicon has a weak fluorescence<br />

between 0.96 and 1.20 eV in the region of the band gap, which is I. 125 eV at 300 K.<br />

This fluorescence is due <strong>to</strong> band gap transitions in the silicon. However, as shown in<br />

Fig. 6.20, porous silicon exhibits a strong pho<strong>to</strong>n-induced luminescence well above<br />

1.4 eV at room temperature. The peak wavelength of the emission depends on the<br />

length of time the wafer is subjected <strong>to</strong> etching. This observation generated much<br />

excitement because of the potential of incorporating pho<strong>to</strong>active silicon using<br />

current silicon technology, leading <strong>to</strong> new display devices or op<strong>to</strong>electronic coupled<br />

elements. Silicon is the element most widely used <strong>to</strong> make transis<strong>to</strong>rs, which are the<br />

on/off switching elements in computers.<br />

Figure 6.21 illustrates one method of etching silicon. Silicon is deposited on a<br />

metal such as aluminum, which forms the bot<strong>to</strong>m of a container made of poly-<br />

ethylene or Teflon, which will not react with the hydrogen fluoride (HF) etching<br />

solution. A voltage is applied between the platinum electrode and the Si wafer such<br />

that the Si is the positive electrode. The parameters that influence the nature of the<br />

pores are the concentration of HF in the electrolyte or etching solution, the<br />

Pho<strong>to</strong>n Energy (eV)<br />

1.4 1.6 1.8 2.0<br />

I I I 1<br />

A<br />

300 K<br />

,6 hr<br />

I I I I I<br />

1.0 0.9 0.8 0.7 0.6<br />

Wavelength (wm)<br />

Figure 6.20. Pho<strong>to</strong>luminescence spectra of porous silicon for two different etching times at<br />

room temperature. Note the change in scale for the two curves. [Adapted from L. T. Camham,<br />

Appl. fhys. Lett. 57, 1046 (1 990).]

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