2Gb: x4, x8, x16 DDR3 SDRAM - Micron
2Gb: x4, x8, x16 DDR3 SDRAM - Micron
2Gb: x4, x8, x16 DDR3 SDRAM - Micron
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Write Leveling Mode Exit Procedure<br />
Figure 47: Write Leveling Exit Procedure<br />
CK#<br />
CK<br />
Command<br />
ODT<br />
R TT DQS, R TT DQS#<br />
R TT(DQ)<br />
After the DRAM are leveled, they must exit from write leveling mode before the normal<br />
mode can be used. Figure 47 depicts a general procedure for exiting write leveling<br />
mode. After the last rising DQS (capturing a 1 at T0), the memory controller should stop<br />
driving the DQS signals after tWLO (MAX) delay plus enough delay to enable the memory<br />
controller to capture the applicable prime DQ state (at ~Tb0). The DQ balls become<br />
undefined when DQS no longer remains LOW, and they remain undefined until tMOD after the MRS command (at Te1).<br />
The ODT input should be de-asserted LOW such that ODTLoff (MIN) expires after the<br />
DQS is no longer driving LOW. When ODT LOW satisfies tIS, ODT must be kept LOW (at<br />
~Tb0) until the DRAM is ready for either another rank to be leveled or until the normal<br />
mode can be used. After DQS termination is switched off, write level mode should be<br />
disabled via the MRS command (at Tc2). After tMOD is satisfied (at Te1), any valid command<br />
may be registered by the DRAM. Some MRS commands may be issued after tMRD (at Td1).<br />
T0 T1 T2 Ta0 Tb0 Tc0 Tc1 Tc2 Td0 Td1 Te0 Te1<br />
NOP NOP NOP NOP NOP NOP NOP MRS NOP Valid NOP Valid<br />
Address MR1<br />
DQS, DQS#<br />
DQ<br />
R TT,nom<br />
t WLO + t WLOE<br />
t IS<br />
CK = 1<br />
tAOF ODTLoff (MIN)<br />
Indicates break<br />
in time scale<br />
t AOF (MAX)<br />
<strong>2Gb</strong>: <strong>x4</strong>, <strong>x8</strong>, <strong>x16</strong> <strong>DDR3</strong> <strong>SDRAM</strong><br />
Write Leveling<br />
t MRD<br />
Undefined Driving Mode<br />
Valid Valid<br />
t MOD<br />
Transitioning<br />
Don’t Care<br />
Note: 1. The DQ result, = 1, between Ta0 and Tc0, is a result of the DQS, DQS# signals capturing<br />
CK HIGH just after the T0 state.<br />
PDF: 09005aef826aaadc<br />
<strong>2Gb</strong>_<strong>DDR3</strong>_<strong>SDRAM</strong>.pdf – Rev. P 2/12 EN 131 <strong>Micron</strong> Technology, Inc. reserves the right to change products or specifications without notice.<br />
� 2006 <strong>Micron</strong> Technology, Inc. All rights reserved.