2Gb: x4, x8, x16 DDR3 SDRAM - Micron
2Gb: x4, x8, x16 DDR3 SDRAM - Micron
2Gb: x4, x8, x16 DDR3 SDRAM - Micron
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Thermal Characteristics<br />
Table 7: Thermal Characteristics<br />
Parameter/Condition Value Unit Symbol Notes<br />
Operating case temperature -<br />
Commercial<br />
Operating case temperature -<br />
Industrial<br />
Operating case temperature -<br />
Automotive<br />
Junction-to-case<br />
(TOP)<br />
0 to +85 °C TC 1, 2, 3<br />
0 to +95 °C TC 1, 2, 3, 4<br />
-40 to +85 °C TC 1, 2, 3<br />
-40 to +95 °C TC 1, 2, 3, 4<br />
-40 to +85 °C TC 1, 2, 3<br />
-40 to +105 °C TC 1, 2, 3, 4<br />
96-ball (JT) 6.5 °C/W �JC 5<br />
96-ball (HA) 3.9<br />
78-ball (DA) M, K 6.5<br />
78-ball (HX) 3.9<br />
<strong>2Gb</strong>: <strong>x4</strong>, <strong>x8</strong>, <strong>x16</strong> <strong>DDR3</strong> <strong>SDRAM</strong><br />
Thermal Characteristics<br />
Notes: 1. Maximum operating case temperature. T C is measured in the center of the package.<br />
2. A thermal solution must be designed to ensure the DRAM device does not exceed T C<br />
MAX during operation.<br />
3. Device functionality is not guaranteed if the DRAM device exceeds T C MAX during operation.<br />
4. If T C exceeds 85°C, the DRAM must be refreshed externally at 2x refresh, which is a 3.9μs<br />
interval refresh rate. The use of SRT or ASR (if available) must be enabled.<br />
5. Thermal resistance data is based on a number of samples from multiple lots and should<br />
be viewed as a typical number.<br />
PDF: 09005aef826aaadc<br />
<strong>2Gb</strong>_<strong>DDR3</strong>_<strong>SDRAM</strong>.pdf – Rev. P 2/12 EN 28 <strong>Micron</strong> Technology, Inc. reserves the right to change products or specifications without notice.<br />
� 2006 <strong>Micron</strong> Technology, Inc. All rights reserved.