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3D Time-of-flight distance measurement with custom - Universität ...

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DEMODULATION PIXELS IN CMOS/CCD 103<br />

no parasitic charge will be integrated. This complete procedure can be repeated<br />

until the amount <strong>of</strong> charge collected in the readout-CCD is large enough for a<br />

sufficient SNR. Now the acquired sampling points can be transported to the<br />

detection stage by clocking the readout-CCD. Each pixel has its own detection<br />

stage (APS-concept, active pixel sensor) that can be selected for readout <strong>with</strong> an<br />

address decoder.<br />

A general problem in using CCD technology is the CCD’s speed performance. The<br />

larger the length <strong>of</strong> a CCD gate, the longer the charge carriers need to travel from<br />

this gate into the neighboring CCD gate. In Chapter 3 we have discussed that (1)<br />

thermal diffusion, (2) self-induced drift (Coulomb forces) and (3) movement in an<br />

electrical field (fringing field) are the only transport mechanisms for free charge<br />

carriers in a semiconductor. Of these three the only directed and thus predictable<br />

mechanism is the movement in a fringing field, the others being statistical<br />

processes. Fringing fields, however, strongly depend on the semiconductor’s<br />

impurity concentration, which is orders <strong>of</strong> magnitudes higher in the CMOS process<br />

that we used than in a real CCD-process, used for commercial CCD sensors.<br />

Therefore, in our CMOS-CCDs the fringing fields only extend to a very small region<br />

between two adjacent gates. The transfer efficiency, only caused by thermal<br />

diffusion, decreases <strong>with</strong> the square root <strong>of</strong> the gate length. This is why, for good<br />

separation efficiency, the CCD gates have to be as short as possible, especially in<br />

our CMOS/CCD process. For the same reason the size <strong>of</strong> the photogate may not<br />

be chosen too large, otherwise the photoelectrons do not arrive in the pipeline-CCD<br />

in time and the demodulation efficiency decreases. This limits the fill factor that can<br />

be realized [CAR, SZ2].<br />

In order to transfer charge-packets from the pipeline CCD into the readout CCD,<br />

transfer gates had to be inserted between both CCD lines. Since only two polylayers<br />

are available and we have to follow special design rules, the insertion <strong>of</strong><br />

transfer gates forces the layout <strong>of</strong> relatively long gates in the pipeline CCD. This<br />

stands in contradiction to our requirement for a high transport speed and a high fill<br />

factor. The advantage <strong>of</strong> this pixel compared to other implementations is the<br />

possibility <strong>of</strong> realizing any number <strong>of</strong> storage sites. For this reason we call it the<br />

“multitap-approach”. It has been introduced as an 8-tap pixel in [SP2] but has also<br />

been realized <strong>with</strong> 16 taps for a special application. A larger number <strong>of</strong> storage<br />

sites <strong>of</strong>fers the possibility <strong>of</strong> operating a TOF-ranger <strong>with</strong> more complex modulation

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