3D Time-of-flight distance measurement with custom - Universität ...
3D Time-of-flight distance measurement with custom - Universität ...
3D Time-of-flight distance measurement with custom - Universität ...
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68 CHAPTER 3<br />
difference <strong>of</strong> only 1 V between the gates <strong>of</strong> 10 µm length, this field is 10 5 V/m, a<br />
value at which the saturation velocity is not yet reached. The drift in such an electric<br />
field would take the electron only about 0.8 nanoseconds. For 30 µm gate length<br />
the traveling time would be 7 nanoseconds for the same potential difference. Also,<br />
for a fixed potential difference, the E-field drift time increases <strong>with</strong> the square <strong>of</strong> the<br />
drift length.<br />
In reality the process <strong>of</strong> carrier movement is a superposition <strong>of</strong> both cases<br />
discussed above. However, the real potential distribution is also a superposition <strong>of</strong><br />
both extreme cases sketched in Figure 3.14 (a+b), we do not have an abrupt<br />
potential step between two gates at different potential nor do we have a linearly<br />
falling potential distribution over the entire gate length. Generally, for typical doping<br />
concentrations, the horizontal electrical field in the semiconductor, caused by a<br />
potential gradient between two neighboring gates, the so-called fringing field, only<br />
extends to a relatively small area between the gates [BEY]. Therefore, for relatively<br />
long gates, the charge transport will be dominated by pure thermal diffusion and<br />
only for very short gates do the fringing fields have an influence. Figure 3.14 (c)<br />
shows a more realistic potential distribution.<br />
The estimation <strong>of</strong> the fringing field extension is relatively complex and also difficult<br />
to simulate, since it strongly depends on the semiconductor’s doping<br />
concentrations. Unfortunately semiconductor foundries keep these exact doping<br />
pr<strong>of</strong>iles secret. At least we know that there are additional impurities and implants,<br />
especially directly beneath the semiconductor surface (e.g. anti-punch through<br />
implants). Due to this lack <strong>of</strong> process-parameter knowledge and the complexity <strong>of</strong><br />
available simulation tools, it appears to be more practical, in the framework <strong>of</strong> this<br />
dissertation, to measure rather than to simulate the actual speed performance.<br />
3.1.4 Noise sources<br />
The performance <strong>of</strong> solid-state imagers is limited by several different noise sources.<br />
These can generally be divided into three classes: (1) photon shot noise,<br />
(2) photocharge conversion noise and (3) quantization noise.<br />
Shot noise (or quantum noise) describes the statistical Poisson-distributed nature <strong>of</strong><br />
the arrival process <strong>of</strong> photons and the generation process <strong>of</strong> electron-hole pairs.