3D Time-of-flight distance measurement with custom - Universität ...
3D Time-of-flight distance measurement with custom - Universität ...
3D Time-of-flight distance measurement with custom - Universität ...
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128 CHAPTER 5<br />
right photogate, where a fraction <strong>of</strong> charge will always travel directly into the<br />
dump diffusion and will never be detected.<br />
(2) Charge carriers are not only collected under the transparent photogates but<br />
also under the adjacent opaque photogates, because (a) the geometry and<br />
position <strong>of</strong> the optical shield is never 100% precise. And (b), even more<br />
important, depending on its wavelength the light penetrates deep into the<br />
semiconductor before it generates electron hole pairs (c.f. Figure 3.4). Then it<br />
diffuses in all directions, not only perpendicularly to the semiconductor surface.<br />
This leads to the blurring effect, which we have already mentioned above.<br />
Here ideal perpendicular diffusion has been assumed. Nevertheless 50% <strong>of</strong> the<br />
charge generated under the left photo gate cannot be separated and will be<br />
collected under the integration gate. Such a behavior would correspond to a<br />
demodulation contrast <strong>of</strong> (5/6-1/6) / (5/6+1/6) = 4/6 = 67%.<br />
This means that, for this simple model, we cannot expect the demodulation contrast<br />
to be better than 67%, even for these idealized DC-conditions. So far, however, we<br />
have neglected two important parameters: (1) the demodulation frequency (the<br />
demodulation contrast will decrease <strong>with</strong> increasing frequencies) and (2) the<br />
influence <strong>of</strong> the light’s wavelength.<br />
Influence <strong>of</strong> the wavelength<br />
As already mentioned, we expect the wavelength <strong>of</strong> the light source used to have<br />
an influence on the achievable demodulation contrast. This is due to the<br />
wavelength-dependent penetration depth <strong>of</strong> incoming light, introduced in<br />
Section 3.1.1. Since, generally, electrical fields <strong>with</strong>in a CMOS-processed<br />
semiconductor exist only near the semiconductor surface, substrate-regions more<br />
than about 2 µm - 5 µm away from the surface are nearly field-free. Charge carriers<br />
that are optically generated in these regions move by thermal diffusion in any<br />
random direction. Either they recombine <strong>with</strong>in the substrate or they are collected<br />
by an electrical field near the surface. However, they can travel up to 100 µm<br />
before being captured by an electrical field (Section 3.1.3). Since red-light<br />
photoelectrons are generated deeper in the semiconductor than blue-light<br />
photoelectrons, their tendency to travel before being detected (crosstalk) is much<br />
higher.