3D Time-of-flight distance measurement with custom - Universität ...

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IMAGING TOF RANGE CAMERAS 169 6.3 3D range camera In addition to the 1-tap pixel realization in a 108-pixel line sensor, we also implemented it in an array of 64 x 25 pixels. We describe the chip architecture, the camera realization and some measured 3D images in this section. 6.3.1 64 x 25 pixel lock-in image sensor The 64 x 25 pixel TOF-imager was fabricated in ORBIT 2.0 µm CMOS/CCD technology using the American MOSIS prototyping service. Chip layout and architecture As for the realization of the line sensor, we used a TINY chip size (2 mm x 2 mm). The 1600 pixels can be randomly accessed by an address decoder; the reset is performed row-wise. The chip architecture and a micrograph of the chip are shown in Figure 6.15. Electrical low-pass characteristic of the modulated photogates (RC string) We have shown in Section 6.2.1 that the serial connection of the CCD modulation gates results in an RC string that limits the maximum demodulation frequency, especially if the gates (i.e. the RC string) are connected only from one side. For the line sensor we could increase the electrical cut-off frequency by a factor of 30 by additionally connecting the CCD gates with metal wires at 3 points within the chain. This is not possible for the image sensor, which is introduced here, since the additional metal wires would drastically increase the pixel size and thus lower the optical fill factor. For the smaller number of pixels per line (64 instead of 108) the situation is, however, not as critical and the connection of the CCD gates from two sides results in a sufficiently fast time response. The SPICE simulation results are shown in Figure 6.16. The gate size of the modulation gates is 21 µm by 6 µm in this imager realization. This leads to a typical ohmic resistance of 75 Ω and a capacitance of 107 fF. The 3 dB cut-off frequency for the slowest gate is 55 MHz.
170 CHAPTER 6 Figure 6.15 5bit row select address decoder 25(L) x 64(C) 1 TAP Lock-in array Pixel address: col. 000000 row 00000 Pixel address: col. 111111 row 11000 6bit column select address decoder TOF image detector: 64 x 25 one-tap pixel array accessed by a 6-bit column and a 5-bit row address decoder. Top: architectural overview, bottom: micrograph of the chip. 5bit row reset address decoder
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3D Time-of-flight distance measurem
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To my parents
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Meinen Eltern
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II 4. Power budget and resolution l
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Abstract Since we are living in a t
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centimeter accuracy. With the singl
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X Eine elegantere Methode zur Entfe
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INTRODUCTION 1 1. Introduction One
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INTRODUCTION 3 light source observe
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INTRODUCTION 5 Propagation time, ho
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INTRODUCTION 7 Chapter 3 gives a sh
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OPTICAL TOF RANGE MEASUREMENT 9 2.
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OPTICAL TOF RANGE MEASUREMENT 25 δ
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OPTICAL TOF RANGE MEASUREMENT 27 c(
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OPTICAL TOF RANGE MEASUREMENT 29 A
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OPTICAL TOF RANGE MEASUREMENT 31 ph
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OPTICAL TOF RANGE MEASUREMENT 33 Ts
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OPTICAL TOF RANGE MEASUREMENT 35 f1
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OPTICAL TOF RANGE MEASUREMENT 43 Fr
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OPTICAL TOF RANGE MEASUREMENT 45 1
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50 CHAPTER 3 the smearing effect, r
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52 CHAPTER 3 3.1 Silicon properties
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54 CHAPTER 3 (a) Figure 3.3 Optical
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56 CHAPTER 3 Quantum efficiency in
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58 CHAPTER 3 The different operatio
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60 CHAPTER 3 (a) (b) Depletion widt
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62 CHAPTER 3 Very special processes
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64 CHAPTER 3 1 kT Dn = ⋅ vth ⋅
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66 CHAPTER 3 The proportionality fa
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68 CHAPTER 3 difference of only 1 V
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70 CHAPTER 3 Flicker noise is cause
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72 CHAPTER 3 A s = sf ⋅ q C ⎡ V
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74 CHAPTER 3 amount of the charge p
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76 CHAPTER 3 substrate (Equation 3.
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78 CHAPTER 3 charge carriers the CT
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80 CHAPTER 3 without causing short
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82 CHAPTER 3 Over an address decode
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84 CHAPTER 3 Orbit’s 2.0µm CMOS/
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86 CHAPTER 4 Figure 4.1 P lens Lamb
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88 CHAPTER 4 Required optical power
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90 CHAPTER 4 4.2 Noise limitation o
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92 CHAPTER 4 number of pseudo-backg
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94 CHAPTER 4 Cmod = 1 QE(λ) = 0.65
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96 CHAPTER 4 Range accuracy (std) i
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DEMODULATION PIXELS IN CMOS/CCD 99
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Page 213 and 214: 196 [BRK] Brockhaus, “Naturwissen
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Page 220 and 221: ACKNOWLEDGMENTS 203 Acknowledgments
Page 222: 206 Publication list 1. R. Lange, P
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