3D Time-of-flight distance measurement with custom - Universität ...
3D Time-of-flight distance measurement with custom - Universität ...
3D Time-of-flight distance measurement with custom - Universität ...
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52 CHAPTER 3<br />
3.1 Silicon properties for solid-state photo-sensing<br />
Assuming that the energy <strong>of</strong> a photon penetrating the semiconductor is higher than<br />
the bandgap <strong>of</strong> the semiconductor material, it will be absorbed (“band to band”<br />
transition) and generate electron-hole pairs, a procedure known as<br />
photoconversion. Once generated, these free charge carriers generally move <strong>with</strong>in<br />
the semiconductor by thermal diffusion and self-induced drift before they recombine<br />
again after a certain lifetime τ [SZ1]. See also Figure 3.12. When they have<br />
recombined, they can no longer be detected and the optical information carried by<br />
the charge carriers is lost. In order to detect the carriers, the electron-hole pairs<br />
have to be separated by an electrical field, either in the space charge region <strong>of</strong> a<br />
(reverse biased) pn-junction, as is the case for photo diodes, or in the depletion<br />
zone <strong>of</strong> a photogate, as is the case in CCD imagers.<br />
3.1.1 Photodiodes in CMOS<br />
For conventional CMOS processes, (we assume p-substrate processes in the<br />
framework <strong>of</strong> this dissertation,) the designer has the freedom to realize different<br />
types <strong>of</strong> photodiodes <strong>with</strong> the available process mask sets, e.g. using the n+ active<br />
layer for an n+ in p-substrate diode (n+ diode) or the n-well layer for an n - in psubstrate<br />
diode (n-well diode). Figure 3.2 schematically shows these diodes in a<br />
cross sectional view. They are biased in reverse direction. Assuming that the<br />
doping concentration <strong>of</strong> one side <strong>of</strong> the pn junction is much larger than the<br />
concentration on the other side, nearly the complete space charge region <strong>of</strong> size<br />
wsc <strong>of</strong> the pn-junction extends to the lower doped region. The following is an<br />
approximation for an abrupt pn junction and complete depletion:<br />
2 ⋅ ε0<br />
⋅ ε<br />
w<br />
Si<br />
sc = ⋅ ( Vbi<br />
+ Vr<br />
)<br />
Equation 3.1<br />
q ⋅ Nlower<br />
(Vbi: built in potential ≈ 0.7..0.8 V; Vr: reverse bias voltage; Nlower: doping<br />
concentration <strong>of</strong> the lower doped region). The table in Figure 3.2 gives typical<br />
process characteristics <strong>of</strong> a 0.5µm standard CMOS process and calculates the<br />
corresponding width <strong>of</strong> the space charge region for a reverse bias <strong>of</strong> 5 V. The<br />
active region (active depth), in which optically generated charge carriers are