3D Time-of-flight distance measurement with custom - Universität ...
3D Time-of-flight distance measurement with custom - Universität ...
3D Time-of-flight distance measurement with custom - Universität ...
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INTRODUCTION 7<br />
Chapter 3 gives a short overview and comparison <strong>of</strong> CCD and CMOS image<br />
sensors. It is pointed out that we have to distinguish between CCD principle and<br />
CCD technology, since the latter is only a dedicated, optimized process for large<br />
area CCD imagers. The CCD principle can also be realized in (slightly modified)<br />
CMOS processes. We have used a 2.0µm CMOS/CCD process for all monolithical<br />
implementations presented in this work. This process makes it possible to realize<br />
CCDs <strong>with</strong> a charge transfer efficiency (CTE) between 96 % and 99.6 % at 20 MHz<br />
transport frequency, depending on the number <strong>of</strong> electrons to be transported (96 %:<br />
10,000 e - , 99.6 %: 1’000’000 e - ). Dedicated CCD processes reach typical CTE<br />
values <strong>of</strong> 99.9998 % and better. In spite <strong>of</strong> the inferior CTE performance compared<br />
<strong>with</strong> a CCD process, the availability <strong>of</strong> the CCD principle <strong>of</strong>fers enormous<br />
capabilities, such as virtually noise-free single electron level signal addition or fast<br />
signal sampling. For these useful properties, which have not been demonstrated<br />
<strong>with</strong> any transistor-based CMOS circuitry so far, a fair CCD performance is<br />
sufficient. This is <strong>of</strong> essential importance for an economic product development,<br />
since (1) CMOS processes are available as Multi-Project-Wafers (MPWs) for<br />
affordable prototyping and (2) additional functionality such as A/D conversion or<br />
any kind <strong>of</strong> signal processing can easily be implemented on chip. The advantages<br />
<strong>of</strong> both CCD and CMOS will be pointed out. The chapter is completed by an<br />
overview <strong>of</strong> those characteristics <strong>of</strong> silicon images sensors in general, that are <strong>of</strong><br />
special interest for the underlying TOF-application: spectral and temporal response,<br />
optical fill factor and noise sources.<br />
Since optical TOF ranging uses active illumination, an optical power budget is very<br />
important. In Chapter 4 we show the relations between the optical power <strong>of</strong> the<br />
light source, the number <strong>of</strong> electrons generated in a pixel <strong>of</strong> the imager and the<br />
resulting output voltage swing. This budget is influenced by the power and<br />
wavelength <strong>of</strong> the light source, the color, reflectivity and <strong>distance</strong> <strong>of</strong> the illuminated<br />
and imaged surface, the choice <strong>of</strong> optics <strong>of</strong> the camera as well as the quantum<br />
efficiency, integration time and internal electrical amplification <strong>of</strong> the image sensor.<br />
Also an estimation <strong>of</strong> the resolution limit is carried out. For this calculation, the<br />
quantum noise is mainly considered as a final theoretical limitation. Together <strong>with</strong><br />
the power budget, the range accuracy can then be calculated depending on the<br />
nature <strong>of</strong> the target and the technical properties <strong>of</strong> the TOF-camera.