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3D Time-of-flight distance measurement with custom - Universität ...

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INTRODUCTION 7<br />

Chapter 3 gives a short overview and comparison <strong>of</strong> CCD and CMOS image<br />

sensors. It is pointed out that we have to distinguish between CCD principle and<br />

CCD technology, since the latter is only a dedicated, optimized process for large<br />

area CCD imagers. The CCD principle can also be realized in (slightly modified)<br />

CMOS processes. We have used a 2.0µm CMOS/CCD process for all monolithical<br />

implementations presented in this work. This process makes it possible to realize<br />

CCDs <strong>with</strong> a charge transfer efficiency (CTE) between 96 % and 99.6 % at 20 MHz<br />

transport frequency, depending on the number <strong>of</strong> electrons to be transported (96 %:<br />

10,000 e - , 99.6 %: 1’000’000 e - ). Dedicated CCD processes reach typical CTE<br />

values <strong>of</strong> 99.9998 % and better. In spite <strong>of</strong> the inferior CTE performance compared<br />

<strong>with</strong> a CCD process, the availability <strong>of</strong> the CCD principle <strong>of</strong>fers enormous<br />

capabilities, such as virtually noise-free single electron level signal addition or fast<br />

signal sampling. For these useful properties, which have not been demonstrated<br />

<strong>with</strong> any transistor-based CMOS circuitry so far, a fair CCD performance is<br />

sufficient. This is <strong>of</strong> essential importance for an economic product development,<br />

since (1) CMOS processes are available as Multi-Project-Wafers (MPWs) for<br />

affordable prototyping and (2) additional functionality such as A/D conversion or<br />

any kind <strong>of</strong> signal processing can easily be implemented on chip. The advantages<br />

<strong>of</strong> both CCD and CMOS will be pointed out. The chapter is completed by an<br />

overview <strong>of</strong> those characteristics <strong>of</strong> silicon images sensors in general, that are <strong>of</strong><br />

special interest for the underlying TOF-application: spectral and temporal response,<br />

optical fill factor and noise sources.<br />

Since optical TOF ranging uses active illumination, an optical power budget is very<br />

important. In Chapter 4 we show the relations between the optical power <strong>of</strong> the<br />

light source, the number <strong>of</strong> electrons generated in a pixel <strong>of</strong> the imager and the<br />

resulting output voltage swing. This budget is influenced by the power and<br />

wavelength <strong>of</strong> the light source, the color, reflectivity and <strong>distance</strong> <strong>of</strong> the illuminated<br />

and imaged surface, the choice <strong>of</strong> optics <strong>of</strong> the camera as well as the quantum<br />

efficiency, integration time and internal electrical amplification <strong>of</strong> the image sensor.<br />

Also an estimation <strong>of</strong> the resolution limit is carried out. For this calculation, the<br />

quantum noise is mainly considered as a final theoretical limitation. Together <strong>with</strong><br />

the power budget, the range accuracy can then be calculated depending on the<br />

nature <strong>of</strong> the target and the technical properties <strong>of</strong> the TOF-camera.

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