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(12) PATENT APPLICATION PUBLICATION
(19) INDIA (21) Application No.: 00843/KOLNP/2005 A
(22) Date of filing of Application: 09/05/2005 (43) Publication Date: 09/06/2006
(54) Title of the invention: ELECTROLYSIS PROCESS AND CELL FOR USE IN SAME
(51) International classification : C25C
1/00,1/12,7/02
(31) Priority Document No : 2002952181
(32) Priority Date : 21/10/2002
(33) Name of priority country : AU
(86) International Application No and : PCT/AU03/001393
Filing Date
: 21/10/2003
(87) International Publication No : WO 04/035868
(61) Patent of addition to Application No : NIL
Filed on : N.A.
(62) Divisional to Application No : NIL
Filed on : N.A.
(57) Abstract:
(71) Name of Applicant:
INTEC LTD
Address of the Applicant:
GORDON CHIU BUILDING J 01
DEPARTMENT CO CHEMICAL
ENGINEERING UNIVERSITY OF SYDNEY
SYDNEY NEW SOUTH WALES 2006
AUSTRALIA
(72) Name of the Inventor:
LAM CHUNG HO
Filed U/S 5(2) before The Patents (Amendment)
Act, 2005: NO
An electrolysis process for the recovery of metal from an aqueous solution is defined. On electrolysing the solution metal is caused to
deposit on a deposition surface of a cathode. The process includes the step of inducing a non-uniform current density across the
deposition surface so as to form areas of high current density interspaced by areas of low current density. The difference between the
areas of high current density and low current density is sufficient to cause metal deposition to be concentrated on the areas of high current
density so as to promote non-uniform deposition of metal across the deposition surface. An electrolysis cell for the electro-recovery of
metal from an aqueous solution is also defined. The cell includes a cathode which includes a deposition surface on which metal is
deposited on electrolysing of the aqueous solution. In operation of the cell, the deposition surface has a non-uniform electrical field
having areas of strong electrical field interspaced by areas of weak electrical field. The difference between the areas of strong electrical
field and weak electrical field is sufficient to cause metal deposition to be concentrated on the areas of high electrical field so as to
promote non-uniform deposition of metal on the surface.
(FIG. - 1)
The Patent Office Journal 09/06/2006 11028