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(12) PATENT APPLICATION PUBLICATION
(19) INDIA (21) Application No.: 01300/KOLNP/2005 A
(22) Date of filing of Application: 05/07/2005 (43) Publication Date: 09/06/2006
(54) Title of the invention: METHOD AND APPARATUS FOR CONTROL OF LAYER THICKNESS
(51) International classification : B05C 1/08, H01L
21/00
(31) Priority Document No : 60/431,346
(32) Priority Date : 05/12/2002
(33) Name of priority country : USA
(86) International Application No and : PCT/CH03/000791
Filing Date
: & 02/12/2003
(87) International Publication No : WO 04/050261
(61) Patent of addition to Application No : NA
Filed on : NA
(62) Divisional to Application No : NA
Filed on : NA
(57) Abstract:
It is shown a method and apparatus for distributing a viscous liquid
over a surface of a substrate (1), e. g. a semiconductor wafer or a
datastorage media, by conditioning the substrate thermally, locally
specific before or during the spin coating process.
(FIG). 1
(71) Name of Applicant:
UNAXIS BALZERS AG.,
Address of the Applicant:
FL-9496 BALZERS, LIECHTENSTEIN.
(72) Name of the Inventor:
CHIEH OU-YANG
Filed U/S 5(2) before The Patents (Amendment)
Act, 2005: NO
The Patent Office Journal 09/06/2006 11089