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(12) PATENT APPLICATION PUBLICATION<br />

(19) INDIA (21) Application No.: 00897/KOLNP/2005 A<br />

(22) Date <strong>of</strong> filing <strong>of</strong> Application: 16/05/2005 (43) Publication Date: 09/06/2006<br />

(54) Title <strong>of</strong> <strong>the</strong> invention: EPOXY RESIN CURING AGENT FOR ENHANCED WEAR RESISTANCE AND<br />

WEATHERABILITY OF CURED MATERIALS<br />

(51) International classification : C08K<br />

5/5419,C08G<br />

59/40,C09D 163/00<br />

(31) Priority Document No : 20024990<br />

(32) Priority Date : 16/10/2002<br />

(33) Name <strong>of</strong> priority country : NO<br />

(86) International Application No and : PCT/NO03/00342<br />

Filing Date<br />

: 16/10/2003<br />

(87) International Publication No : WO 04/035675 A1<br />

(61) Patent <strong>of</strong> addition to Application No : NIL<br />

Filed on : N.A.<br />

(62) Divisional to Application No : NIL<br />

Filed on : N.A.<br />

(57) Abstract:<br />

(71) Name <strong>of</strong> Applicant:<br />

SINTEF<br />

Address <strong>of</strong> <strong>the</strong> Applicant:<br />

RICHARD BIRKELANDS VEI 2B,N-7466<br />

TRONDHEIM NORWAY<br />

(72) Name <strong>of</strong> <strong>the</strong> Inventor:<br />

1. REDFORD KEITH<br />

2. MANNLE FERDINAND<br />

3. GAARDER RUNE H<br />

Filed U/S 5(2) before The <strong>Patents</strong> (Amendment)<br />

Act, 2005: NO<br />

Hardener for curing <strong>of</strong> epoxy resins which produces materials with high abrasion resistance, photostability and chemical resistance. The<br />

hardener comprises a sol prepared by controlled hydrolysis and condensation <strong>of</strong> compounds <strong>of</strong> <strong>the</strong> type: (X-B-)n Si(-Y)4-n where n = 1 or<br />

2, X = SH, -N=C=O, or NR1R2, R1, R2 being chosen from hydrogen, saturated or unsaturated C1-C18-alkyl, substituted or non-substituted<br />

aryl, formyl, aliphatic or aromatic carbonyl, carbamoyl, sulphonyl, sulphoxyl, phosphonyl, sulphinyl, phosphinyl, while <strong>the</strong> carbon chains<br />

<strong>of</strong> said compounds may include one or more <strong>of</strong> <strong>the</strong> elements oxygen, nitrogen, sulphur, phosphorus, silicon and boron, and/or may<br />

include one or more hydrolysable silane units, or R 1, R2 are chosen from condensation products or addition products <strong>of</strong> one or more<br />

types or chemical compounds such as acids, alcohols, phenols, amines, aldehydes or epoxides. B is a spacing group chosen from<br />

saturated or unsaturated C1-C18-alkylene, substituted or nonsubstituted arylene, while <strong>the</strong> carbon chains <strong>of</strong> <strong>the</strong> stated compounds may<br />

optionally include one or more <strong>of</strong> <strong>the</strong> elements oxygen, nitrogen, sulphur, phosphorus, silicon and boron. Y is chosen from hydrolisable<br />

groups such as alkoxy, carboxyl, and halogen.<br />

(FIG. - Nil)<br />

The Patent Office Journal 09/06/2006 11044

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