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(12) PATENT APPLICATION PUBLICATION<br />

(19) INDIA (21) APPLICATION No: 776/MAS/1998A<br />

(22) Date <strong>of</strong> filing <strong>of</strong> Application: 13/04/1998 (43) Publication Date: 09/06/2006<br />

(54) Title <strong>of</strong> <strong>the</strong> invention:<br />

A METHOD FOR MAKING A PINHOLE<br />

RESISTANT SUBSTRATE.<br />

(51) International classification: C 08 L<br />

23/02 , C 08 L 23:04 , C 08 L 23:08<br />

(31) Priority Document No.60/043,780<br />

(32) Priority Date: 11/04/1997<br />

(33) Name <strong>of</strong> priority country: USA<br />

(87) WIPO No. :<br />

(61) Patent <strong>of</strong> addition to<br />

Application No. :<br />

Filed on:<br />

(62) Divisional to<br />

Application No.:<br />

Filed on:<br />

(71) Name <strong>of</strong> Applicant<br />

DOW GLOBAL TECHNOLOGIES INC.<br />

Address <strong>of</strong> Applicant:<br />

Washington Street, 1790 Building, Midland,<br />

MI 48674 ,<br />

U.S.A.<br />

(72) Name <strong>of</strong> <strong>the</strong> Inventor(s):<br />

JAMES L COOPER.<br />

MICHAEL W POTTS.<br />

(57) Abstract<br />

The present invention relates to a method for making a pinhole- resistant substrate comprising: (a) providing<br />

an extrusion composition comprising at least one olefin polymer wherein <strong>the</strong> composition is characterized as having a<br />

corrected or actual Goettfert melt strength value at 190 C., as measured using a Rheotens unit, in <strong>the</strong> range <strong>of</strong> from<br />

0.01 centiNewtons to 7.25 centiNewtons, (b) applying <strong>the</strong> composition to a substrate, (c) collecting <strong>the</strong> substrate with<br />

<strong>the</strong> extruded coating or laminated film for subsequent use or transferring <strong>the</strong> substrate with <strong>the</strong> extruded coating or<br />

laminated film for fur<strong>the</strong>r processing, <strong>the</strong> coating or laminate being characterized as having from 0 to 1 pinholes per<br />

cm2 <strong>of</strong> <strong>the</strong>rmally exposed area after exposure to hot air at 537 C. for 0.75 second.<br />

The Patent Office Journal 09/06/2006 10788

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