24/06/2005 - Controller General of Patents, Designs, and Trade Marks

(12) PATENT APPLICATION PUBLICATION
(19)
INDIA (21) Application No: 689/MUMNP/2003 A
(22) Date of filing of Application : 10/07/2003
(54) Title of the invention:
(51) International Classification: H 05 K 7/10 (71)
(31) Priority Document No. : 09/753,327
(32) Priority Date :
(33) Name of priority country :
(86)
(43) Publication Date: 24/06/2005
AN INTEGRATED CIRCUIT PACKAGE AND SOCKET, AND AN
INTEGRATED CIRCUIT POWER DELIVERY SYSTEM.
30/12/2000
USA
International Application : PCT/US01/44828
No. and Filing Date : 27/11/2001
(87) International :
Publication No. WO02/054487 A1
(61)
(62)
Patent of addition to
Application No. : NIL
Filed on N.A.
Divisional to
Application No. : NIL
Filed on : N.A.
(57) Abstract : A socket and package apparatus are disclosed
for increasing the amount of power that can be delivered from
an IC board to an IC where the IC package is mounted in a
socket connected to the IC board. The apparatus has two
separable and distinct parts designed to electrically engage.
The package is designed with a power bar where the panels of
the power bar are permanently and electrically connected to
various power planes of the IC package along its entire
adjacent wall. The socket is designed with a power bar carrier
designed to maximize the current flow from the IC board to
the power bar. The package is then engaged into the socket.
Total Pages : 32.
(72)
Name of the Applicant:
INTEL CORPORATION
Address of the Applicant:
2200 MISSION COLLEGE BOULEVARD,
SANTA CLARA,
CALIFORNIA 95052,
UNITED STATES OF AMERICA.
Name of the Inventors:
1. XIE HONG
2. STONE BRENT S.
Filed U/S 5(2) before the
Patents (Amendment)
( Figure: 01 )
The Patent Office Journal 24.06.2005 17815