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24/06/2005 - Controller General of Patents, Designs, and Trade Marks

24/06/2005 - Controller General of Patents, Designs, and Trade Marks

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(21) Application No. 722/DEL/2000 A (22) Date <strong>of</strong> filing <strong>of</strong> Application: 09/08/2000<br />

(54) Title <strong>of</strong> the invention: “A METHOD FOR FORMING A DIFFUSION REGION IN A SILICON<br />

SUBSTRATE.”<br />

(51) International Classification 7 : H 01L 21/20<br />

(30) Priority Data :<br />

(31) Document No.: 09/400,676<br />

(32) Date : 21/09/1999<br />

(33) Name <strong>of</strong> convention country :<br />

U.S.A.<br />

(66) Filed U/s 5(2) : NIL<br />

(61) Patent <strong>of</strong> addition to application No. : NA<br />

(62) Filed on : NA<br />

(63) Divisional to Application No. :NIL<br />

(64) Filed on : NA<br />

Total No. <strong>of</strong> Pages: 19<br />

(57) Abstract:<br />

(71) Name <strong>of</strong> the applicant:<br />

INTERNATIONAL BUSINESS<br />

MACHINE CORPORATION.<br />

Address <strong>of</strong> the Applicant:<br />

Armonk, New York 10504, U.S.A.<br />

(72) Name <strong>of</strong> the Inventor:<br />

COOLBAUGH DOUGLAS D.<br />

HARAME DAVID L.<br />

A method <strong>of</strong> forming a diffusion region in a silicon substrate having low-resistance, acceptable defect<br />

density, reliability <strong>and</strong> process control comprising the steps <strong>of</strong>: (a) subjecting a silicon substrate to a<br />

first ion implantation step, said first ion implantation step being conducted under conditions such that a<br />

region <strong>of</strong> amorphized Si is formed in said silicon substrate; (b) subjecting said silicon substrate<br />

containing said region <strong>of</strong> amorphized Si to a second ion implantation step, said second ion implantation<br />

step being carried out by implanting a dopant ion into said silicon substrate under conditions such that<br />

the peak <strong>of</strong> implant <strong>of</strong> said dopant ion is within the region <strong>of</strong> amorphized Si; <strong>and</strong> (c) annealing said<br />

silicon substrate under conditions such that said region <strong>of</strong> amorphized Si is re-crystallized thereby<br />

forming a diffusion region in said silicon substrate is provided.<br />

18214

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