24/06/2005 - Controller General of Patents, Designs, and Trade Marks

(21) Application No. 1022/DEL/2000 A (22) Date of filing of Application: 14/11/2000
(54) Title of the invention: “ELECTRONIC PACKAGE AND METHOD OF FORMING
ELECTRONIC PACKAGE.”
(51) International Classification 7 :
H01L 23/48, H01L23/12
(30) Priority Data :
(31) Document No.: 09/471,679
(32) Date : 23.12.1999
(33) Name of convention country : U.S.A..
(66) Filed U/s 5(2) : NIL
(61) Patent of addition to application No. :
NA
(62) Filed on : NA
(63) Divisional to Application No. :NIL
(64) Filed on : NA
(57) Abstract:
(71) Name of the applicant:
International Business Machine Corporation;
Address of the Applicant:
Company Organized and Existing Under The
Law of NEW YORK, United States Of America,
Of Armonk, New York 10504, U.S.A.
(72) Name of the Inventor:
BRODSKY William L;
SATHE Sanjeev B.;
THIEL George H.;
A semiconductor chip package having a non–planar chip therein, to reduce the stress
concentrations between the chip and cover plate. In particular, a chip and method of forming a chip
having a non–planar of “domed” back surface, wherein the thickness of the non–planar chip is
greatest substantially near the center of the chip. Further, a method of rounding the edges or
corners of the chip to reduce crack propagation originating at the edges of the chip.
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