24/06/2005 - Controller General of Patents, Designs, and Trade Marks

Publication After 18 months
The following Patent application have been published under Section 11A of the Patents
(Amendment) Act, 2005
(21) Application No.: 1169/MUMNP/2003 A
(PCT/US02/21082)
(22) Date of filing of
Application:
24/12/2003
(54) Title of the invention: METHOD OF ABLATING AN OPENING INA HARD, NON-
METALLIC SUBSTRATE
(51) International classification: B23K 15/08
(30) Priority Data:
(31) Document No.: 60/302,495
(32) Date: 02/07/2001
(33) Name of convention country: USA
(66) Filed U/s. 5(2): NO
(61) Patent of addition to application No.: NIL
(62) Filed on: N.A.
(63) Divisional to Application No.: NIL
(64) Filed on: N.A.
(71) Name of the Applicant:
VIRTEK LASER SYSTEMS, INC.
Address of the Applicant:
785 BRIDGE STREET, WATERLOO,
ONTARIO, N2V 2K1, CANADA.
(72) Name of the Inventors:
1. GLOVER, RUIZ,
2. CUMMINGS, MIKE,
3. ARCHIBALD, CEC.
(57) Abstract: A method of ablating a hole into a hard, non-metallic substrate (24) is disclosed. At least on laser
assembly (12) capable of generating a laser beam (16a) in an axis having a focus that is moveable relative to the axis is
provided. A focus of the laser beam (16a) is positioned adjacent at least one surface of the substrate (24). A first layer
(Pass-1) of the substrate (24) is ablated by the laser beam (16a). The focus is moved relative to the axis corresponding
to the depth of the substrate (24) thereby enabling ablation of successive layers (Pass 2-10) of the substrate (24) are
ablated to generate a hole (32) into the substrate (24).
Figure: 2B.
The Patent Office Journal 24.06.2005 17884