24/06/2005 - Controller General of Patents, Designs, and Trade Marks

(12) PATENT APPLICATION PUBLICATION
(19) INDIA (21) Application No.: IN/PCT/2002/00332/MUM A
(22) Date of filing of Application: 19/03/2002 (43) Publication Date: 24/06/2005
(54) Title of the invention: : A METHOD OF CONSTRUCTING AN ELECTRONIC ASSEMBLY
(51) International classification : H01L 23/34
(31) Priority Document No : 09/394,860
(32) Priority Date : 13/09/1999
(33) Name of priority country : USA
(86) International Application
No and Filing Date:
(87) International Publication
No
(61) Patent of addition to
Application No
: PCT/US00/23778
29/08/2000
: WO 01/20673 A1
:
NIL
Filed on : N.A.
(62) Divisional to Application
No
: NIL
Filed on : N.A.
(71) Name of Applicant:
INTEL CORPORATION
Address of the Applicant:
DELAWARE CORPORATION, 2200
MISSION COLLEGE BOULEVARD,
SANTA CLARA, CALIFORNIA 95052,
USA.
(72) Name of the Inventor:
1. DISHONGH TERRANCE J.
2. CHURILLA PAUL W.
3. PULLEN DAVID H.
Filed U/S 5(2) before The
Patents (Amendment)
Ordinance, 2004: NO
(57) Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The
electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip
mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises
securing the thermally conductive member and the semiconductor pakage in a selected orientation relative to one another
with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the
substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance
is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive
member on an opposing side.
Total Pages: 16.
(FIG.- 11.)
The Patent Office Journal 24.06.2005 17777