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Radio Frequency Integrated Circuit Design - Webs

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Figure 10.42 High-Q matching circuit.<br />

Power Amplifiers<br />

and collector stripes (multiple fingers), as shown in Figure 10.43, as well as<br />

multiple transistors distributed to reduce the concentration of heat and to reduce<br />

the current density. However, the use of transistors with multiple fingers and<br />

multiple transistors introduces the new concern of making sure each finger and<br />

each transistor is treated the same as every other finger and transistor. This is<br />

important in order to avoid local hot spots or thermal runaway and to make<br />

sure that the connection to and from each transistor is exactly the same to avoid<br />

mismatch of phase shifts. Power combining will be discussed further in Section<br />

10.17, and thermal runaway is discussed further in Section 10.18.<br />

Also, for such high currents, metal lines have to be made wide to avoid<br />

problems with metal migration, as described in Section 5.6.<br />

As for transistors, a large transistor cannot become too long or it will not be<br />

able to handle its own current. With transistors, the current handling capability is<br />

directly proportional to emitter area. Thus, as the emitter length is doubled,<br />

the current is doubled. However, if line width stays the same, the maximum<br />

current capability is the same. As an example, a transistor that has emitters that<br />

are 40 �m long and has 1-�m-wide lines can only handle about 1 mA. However,<br />

389

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