REFERENCE MANUAL - FTP Directory Listing - Trimble

SHIPPING and HANDLING 9
Recommended Soldering Profile
Figure 9.2
Recommended Soldering Profile
C
Select the final soldering thermal profile very carefully. The thermal profile depends
on the choice of the solder paste, thickness and color of the carrier board, heat
transfer, and size of the penalization.
WARNING – For a double-sided surface-mount carrier board, the unit must be placed on
the secondary side to prevent falling off during reflow.
Optical Inspection
After soldering the Copernicus GPS module to the carrier board, follow IPC-610
specification to visually inspect using 3X magnification lens to verify the following:
• Each pin is properly aligned with mount pad.
• Pads are properly soldered.
• No solder is bridged to the adjacent pads. X-ray the bottom pad if necessary.
Copernicus GPS Receiver 91