REFERENCE MANUAL - FTP Directory Listing - Trimble

9 SHIPPING and HANDLING
Cleaning
When the Copernicus GPS module is attached to the user board, a cleaning process
voids the warranty. Please use a “no-clean” process to eliminate the cleaning process.
The silver plated Copernicus GPS module may discolor with cleaning agent or
chlorinated faucet water. Any other form of cleaning solder residual may cause
permanent damage and will void the warranty.
Soldering Guidelines
Repeated Reflow Soldering
The Copernicus GPS lead-free silver plated module can withstand two-reflow solder
processes. If the unit must mount on the first side for surface-mount reflow, add glue
on the bottom of the module to prevent falling off when processing the second side.
Wave Soldering
The Copernicus GPS module cannot soak in the solder pot. If the carrier board is
mixed with through-hole components and surface mount devices, it can be processed
with one single lead-free wave process. The temperature of the unit will depend on
the size and the thickness of the board. Measure the temperature on the module to
ensure that it remains under 180 °C.
Hand Soldering
For the lead-free Copernicus GPS module, use a lead-free solder core, such as Kester
275 Sn96.5/Ag3/Cu0.5. When soldering the module by hand, keep the soldering iron
below 260 °C.
Rework
The Copernicus GPS module can withstand one rework cycle. The module can heat
up to the reflow temperature to precede the rework. Never remove the metal shield
and rework on the module itself.
Conformal Coating
Conformal coating on the Copernicus GPS module is not allowed. Conformal coating
will void the warranty.
92 Copernicus GPS Receiver