REFERENCE MANUAL - FTP Directory Listing - Trimble
REFERENCE MANUAL - FTP Directory Listing - Trimble
REFERENCE MANUAL - FTP Directory Listing - Trimble
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9 SHIPPING and HANDLING<br />
Baking Procedure<br />
C<br />
If baking is necessary, <strong>Trimble</strong> recommends baking in a nitrogen purge oven.<br />
Temperature: 125 °C<br />
Duration: 24 Hours.<br />
After Baking: Store in a nitrogen-purged cabinet or dry box to prevent<br />
absorption of moisture.<br />
WARNING – Do not bake the units within the tape and reel packaging.Repeated baking<br />
processes will reduce the solderablity.<br />
Soldering Paste<br />
The Copernicus GPS module itself is not hermetically sealed, <strong>Trimble</strong> strongly<br />
recommends using the “No Clean” soldering paste and process. The castellation<br />
solder pad on this module is plated with silver plating. Use Type 3 or above soldering<br />
paste to maximize the solder volume. An example is provided below.<br />
Solder paste: Kester EM909<br />
Alloy composition: Sn96.5Ag3Cu.5 (SAC305) 96.5% Tin/ 3%Silver/ 0.5%<br />
Copper<br />
Liquidus Temperature:221 °C<br />
Stencil Thickness: 5 Mil (0.005")<br />
Stencil opening requires 4-mil toe over paste in the X and Y directions.<br />
Note – Consult solder paste manufacturer and the assembly process for the approved<br />
procedures.<br />
Solder Reflow<br />
C<br />
A hot air convection oven is strongly recommended for solder reflow. For the leadfree<br />
solder reflow, we recommend using a nitrogen-purged oven to increase the solder<br />
wetting. Reference IPC-610D for the lead free solder surface appearance.<br />
WARNING – Follow the thermal reflow guidelines from the IPC-JEDEC J-STD-020C.<br />
The size of this module is 916.9 mm3. According to J-STD-020C, the peak<br />
component temperature during reflow is 245 +0 °C.<br />
90 Copernicus GPS Receiver
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