Carbon Nanotube Reinforced Composites: Metal and Ceramic ...

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Figure 3.3 Comparison between experimental CTE values and theoretical predictions for Al/SWNT nanocomposites. Reproduced with permission from [20]. Copyright Ó (2004) Elsevier. considerably lower than those predicted from the rule of mixtures (ROM) and Kerner models, but are closer to those predicted by the Schapery equation. As mentioned above, the lower limit of the Schapery model determines the CTE of composites having an interconnected filler network. For the Al/SWNTnanocomposites, the large aspect ratio of conducting SWNTs facilitates formation of interconnected filler network. The deviation of the measured CTE values for the nanocomposites with fillers 15 vol% from Schapery model is due to the agglomeration of SWNTs. Jang et al. determined the thermal conductivity of 2024 Al alloy reinforced with 3 wt% carbon nanofibers of 120 nm diameter [22]. The nanocomposites were prepared by ball milling followed by hot isostatic pressing. Figure 3.4 shows thermal conductivity vs temperature plots for the 2024 Al alloy and 2024 Al/3 wt% CNF nanocomposite. The thermal conductivity of the 2024 Al/3 wt%CNF nanocomposite increases linearly with temperature between 15 and 300 K. The incorporation of carbon nanofibers with very high thermal conductivity (1260–2000 W m 1 K 1 ) into 2024 Al alloy improves its thermal conductivity by 70% at room temperature. The thermal conductivity of 2024 Al/3 wt%CNF nanocomposite at room temperature ( 260 W m 1 K 1 ) is comparable to that of copper based composite reinforced with 30% carbon fiber (250 W m 1 K 1 ) as listed in Table 3.1. 3.2.2 Tin-Based Nanosolder 3.2 Thermal Behavior of Metal-CNT Nanocompositesj95 Advances in IC technology have led to the development of miniaturized semiconductor devices with advanced functional properties. Successful development of these devices requires proper understanding and tackling of thermal management,
96j 3 Physical Properties of Carbon Nanotube–Metal Nanocomposites Figure 3.4 Thermal conductivity of the 2024 Al alloy and 2024 Al/3 wt% CNF nanocomposite between 15 and 300 K. *: 2024 Al/3 wt% CNF; &: 2024 Al. Reproduced with permission from [22]. Copyright Ó (2007) Sage Publications. materials selection and electronic packaging issues. Tin–lead solder alloy (Sn–37%Pb) is often used to connect chips to the packaging substrates in flip chip technology and surface mount technology due to its excellent solderability and low melting point (183 C). However, the microstructure of the Sn–37%Pb alloy coarsens at elevated temperature, leading to the degradation of mechanical property and reliability of the joint. Further, the Sn–37%Pb alloy possesses environmental hazard because of its high lead content. Therefore, the electronic industry is seriously searching for lead-free alloy (e.g. SnAgCu solder) used for interconnects. As solder joints become increasingly miniaturized to meet the challenges of electronic packaging, the reliability of the flip chip solder joints has attracted considerable attention [23]. To improve the reliability efficiency of solder joints, second phase particles and reinforcing fillers are added to the solder alloys [24, 25]. The second phase particles or fillers can enhance the strength, suppress grain boundary sliding and grain growth of solder alloys. It is considered that CNT with superior mechanical, electrical and thermal properties is an excellent candidate reinforcement material for a nanocomposite solder [26–30]. Mohan Kumar et al. from the National University of Singapore studied the effects of single-wall CNTadditions on the thermal and mechanical properties of Sn–37%Pb and lead-free Sn–3.8%Ag–0.7%Cu solder alloys [25–27]. They prepared nanocomposite solders by powder metallurgy followed by sintering, and reported that the SWNT additions improve the mechanical strength and stiffness of solder alloys. Moreover, the melting temperature of the solder alloy decreased slightly on incorporation of CNTs as revealed by differential scanning calorimetric (DSC) curves (Figure 3.5(a) and (b)). This implies that there is no need to adjust existing soldering practices when using CNT-reinforced solder alloy. The CTE of the Sn–37%Pb solder
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Sie Chin Tjong Carbon Nanotube Rein
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Sie Chin Tjong Carbon Nanotube Rein
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Contents Preface IX List of Abbrevi
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5 Carbon Nanotube-Ceramic Nanocompo
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Preface Carbon nanotubes are nanost
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XII List of Abbreviations HIP hot i
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1 Introduction 1.1 Background Compo
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Figure 1.2 Transmission electron mi
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1.3 Synthesis of Carbon Nanotubes 1
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MWNTs can be as high as 70% of the
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Figure 1.7 In situ TEM images recor
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1.3 Synthesis of Carbon Nanotubesj1
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show TEM images of MWNTs synthesize
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Since then, large efforts have been
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1.3.4 Patent Processes Carbon nanot
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1.4 Purification of Carbon Nanotube
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Table 1.3 Patent processes for the
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Figure 1.13 Schematic illustration
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1.5 Mechanical Properties of Carbon
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Figure 1.14 Carbon nanotubes in hig
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Figure 1.15 In situ tensile deforma
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Table 1.7 Theoretical and experimen
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Nomenclature ~a 1 , ~a 2 Unit vecto
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carbon nanotubes. Physical Review L
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70 Jang, I., Uh, H.S., Cho, H.J., L
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108 Shelimov, K.B., Esenaliev, R.O.
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Bonnamy, S., Beguin, F., Burnham, N
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2 Carbon Nanotube-Metal Nanocomposi
Page 60 and 61: isostatic pressing. In certain case
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Page 64 and 65: coating material, the plasma gun an
Page 66 and 67: Table 2.4 Changes in the size and v
Page 68 and 69: Figure 2.6 (a) Low and (b) high mag
Page 70 and 71: Figure 2.8 SEM micrographs showing
Page 72 and 73: Figure 2.11 Bright field TEM microg
Page 74 and 75: Figure 2.13 TEM image of bulk Al/5
Page 76 and 77: 2.5 Magnesium-Based Nanocomposites
Page 78 and 79: limited improvement in ultimate ten
Page 80 and 81: Figure 2.18 SEM micrographs of the
Page 82 and 83: Figure 2.19 (a) Low and (b) high ma
Page 84 and 85: Figure 2.22 SEM micrographs of (a)
Page 86 and 87: Figure 2.25 (a) TEM micrograph show
Page 88 and 89: 2.8 Transition Metal-Based Nanocomp
Page 90 and 91: Figure 2.27 TEM image of electrodep
Page 92 and 93: Figure 2.29 SEM micrographs of (a)
Page 94 and 95: Figure 2.31 Schematic representatio
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Page 98 and 99: Materials Science Forum, 534-536 (P
Page 100 and 101: composite. Materials Science and En
Page 102: 111 Cha, S.I., Kim, K.T., Arshad, S
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Page 109: 94j 3 Physical Properties of Carbon
Page 115 and 116: 100j 3 Physical Properties of Carbo
Page 117 and 118: 102j 3 Physical Properties of Carbo
Page 119 and 120: 104j 4 Mechanical Characteristics o
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146j 5 Carbon Nanotube-Ceramic Nano
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170j 6 Physical Properties of Carbo
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Table 8.1 Patent processes for maki
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218j 8 Conclusions development of c
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220j 8 Conclusions Figure 8.2 TEM m
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222j 8 Conclusions increase in Vick
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224j 8 Conclusions References 1 Cha
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226j 8 Conclusions nano-matrix. Scr
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228j Index l laser ablation 7 load
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