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Carbon Nanotube Reinforced Composites: Metal and Ceramic ...

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Figure 2.27 TEM image of electrodeposited Ni/MWNT<br />

nanocomposite showing uniform distribution of CNTs.<br />

Reproduced with permission from [102]. Copyright Ó (2008)<br />

Elsevier.<br />

a mean grain size of 28 nm (Figure 2.28). The formation of nanograins coupled<br />

with CNT reinforcement lead to the enhancement of mechanical properties as<br />

expected.<br />

Compared with d.c. deposition, pulse-plating <strong>and</strong> pulse-reverse plating facilitate<br />

larger amounts of filler incorporation into the matrix of metal-matrix nanocomposites<br />

under the same current density [103, 104]. For example, the maximum<br />

alumina incorporation in nickel <strong>and</strong> copper matrix using direct current method<br />

is 1.5 wt% <strong>and</strong> 3.5 wt%, respectively. However, a maximum incorporation of<br />

5.6 wt% alumina in a copper matrix can be achieved by pulse plating [103]. Sun et al.<br />

used deposited Ni/SWNT<strong>and</strong> Ni/MWNTnanocomposite coatings in the Watt bath<br />

solution using d.c. <strong>and</strong> pulse-reverse plating methods [105]. As expected, the d.c.<br />

method produces uneven surface coating with many deposit protrusions. The<br />

coatings formed by the pulse-reverse method exhibit good interfacial bonding<br />

between CNTs <strong>and</strong> the metal matrix. Guo et al. demonstrated that higher pulse<br />

frequency <strong>and</strong> higher pulse reverse ratio employed during electrodeposition of<br />

Figure 2.28 TEM dark-field image showing formation of Ni<br />

nanograins (28 nm) in Ni/MWNT composite prepared by<br />

electrodeposition. Reproduced with permission from [102].<br />

Copyright Ó (2008) Elsevier.<br />

2.8 Transition <strong>Metal</strong>-Based Nanocompositesj75

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