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Carbon Nanotube Reinforced Composites: Metal and Ceramic ...

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Figure 2.18 SEM micrographs of the AZ31/MWCNT surface<br />

nanocomposite specimens prepared by the FSP technique. (b),(d)<br />

<strong>and</strong> (f) are higher magnification views inside a dotted circle of (a),<br />

(c) <strong>and</strong> (e), respectively. Reproduced with permission from [66].<br />

Copyright Ó (2006) Elsevier.<br />

2.7<br />

Copper-Based Nanocomposites<br />

2.7 Copper-Based Nanocompositesj65<br />

Copper is a ductile metal having low mechanical strength but excellent electrical <strong>and</strong><br />

thermal conductivities. To enhance the mechanical strength, ceramic reinforcements<br />

are added to copper [73–76]. In recent years, microelectonic devices made from<br />

integrated circuits generate enormous local heat during operation. There is a growing<br />

dem<strong>and</strong> for high strength Cu-based composite materials in microelectronic packaging.<br />

However, poor compatibility between SiC <strong>and</strong> Cu is the main problem in the

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