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TMS320C6713B Floating-Point Digital Signal Processor (Rev. A)

TMS320C6713B Floating-Point Digital Signal Processor (Rev. A)

TMS320C6713B Floating-Point Digital Signal Processor (Rev. A)

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SPRS294A − OCTOBER 2005 − REVISED NOVEMBER 2005<br />

device and development-support tool nomenclature (continued)<br />

TMS 320 C 6713B GDP ( ) 300<br />

DEVICE SPEED RANGE<br />

167 MHz<br />

200 MHz<br />

225 MHz<br />

300 MHz<br />

PREFIX<br />

TMX = Experimental device<br />

TMP = Prototype device<br />

TMS = Qualified device<br />

SMJ = MIL-PRF-38535, QML<br />

SM = High Rel (non-38535)<br />

TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)<br />

Blank = 0°C to 90°C, commercial temperature<br />

A = −40°C to 105°C, extended temperature<br />

DEVICE FAMILY<br />

320 = TMS320 DSP family<br />

PACKAGE TYPE†‡§<br />

GDP = 272-pin plastic BGA<br />

PYP = 208-pin PowerPAD plastic QFP<br />

ZDP = 272-pin plastic BGA, with Pb-free soldered balls<br />

TECHNOLOGY<br />

C = CMOS<br />

DEVICE<br />

C6713B<br />

† BGA = Ball Grid Array<br />

QFP = Quad Flatpack<br />

‡ The ZDP mechanical package designator represents the version of the GDP with Pb−Free soldered balls. The ZDP package<br />

devices are supported in the same speed grades as the GDP package devices (available upon request).<br />

§ For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this<br />

document or the TI website (www.ti.com).<br />

Figure 12. TMS320C6000 DSP Device Nomenclature (Including the <strong>TMS320C6713B</strong> Device)<br />

MicroStar BGA and PowerPAD are trademarks of Texas Instruments.<br />

66 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443

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