Semiconductor Equipment - Berenberg Bank
Semiconductor Equipment - Berenberg Bank
Semiconductor Equipment - Berenberg Bank
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
ASML Holding NV<br />
Technology Hardware<br />
We estimate that ASML will hold an 80% share of the market in 2016, and<br />
maintain its current penetration rate with existing customers. We do not expect<br />
Nikon to develop EUV tools before 2015, and its ArFi tool’s throughput lags<br />
ASML’s tool. The throughput of Nikon’s NSR-S622D ArFi tool, released in<br />
January 2013, is 200wph versus 250wph of ASML’s NXT:1970Ci (to be released in<br />
Q3 2013). Throughput is a key specification watched by chip-makers, as higher<br />
wph means greater efficiency and cost-reduction per chip. We expect Nikon’s<br />
shipments to remain at low levels and Intel will remain its main customer.<br />
Figure 4: Lithography tool unit shipment<br />
Type ASP units 2009 2010 2011 2012 2013E 2014E 2015E<br />
I-Line EUR 4-5m ASML 12 23 20 15 15 12 8<br />
Nikon* 4 16 35 16 21 20 15<br />
Canon 8 23 45 43 40 38 38<br />
KrF EUR 9-12m ASML 17 68 87 78 52 50 32<br />
Nikon* 16 12 28 3 6 8 10<br />
Canon 3 6 7 3 3 2 1<br />
ArF Dry EUR 20-23m ASML 10 12 11 4 4 8 8<br />
Nikon* 1 1 3 8 11 8 8<br />
Canon 0 0 0 0 0 0 0<br />
ArFi EUR 35-40m ASML 31 94 101 72 69 72 67<br />
Nikon* 15 28 18 13 15 13 8<br />
Canon 2 0 0 0 0 0 0<br />
EUV EUR 70-100m ASML 0 0 3 1 3 15 24<br />
Nikon* 0 0 0 0 0 0 2<br />
Canon 0 0 0 0 0 0 0<br />
Total 119 283 358 256 239 246 221<br />
ASML% 59% 70% 62% 66% 60% 64% 63%<br />
Nikon% 30% 20% 23% 16% 22% 20% 19%<br />
Canon % 11% 10% 15% 18% 18% 16% 18%<br />
Source: Company data, <strong>Berenberg</strong> estimates<br />
*Nikon 2012: FY March 2013<br />
We do not believe that the depreciation of the yen will give Nikon a competitive<br />
advantage over ASML. Chip-makers are unlikely to switch vendors purely to<br />
obtain a lower price: the reconfiguration and integration costs associated with new<br />
tools is likely to be more than the difference in ASP. Furthermore, chip-makers<br />
usually value tool specifications and reliability more than they do price points.<br />
33