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Semiconductor Equipment - Berenberg Bank

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ASML Holding NV<br />

Technology Hardware<br />

EUV drives ASML’s future success<br />

EUV is the key enabler of Moore’s law, and ASML holds 100%<br />

market share<br />

<strong>Semiconductor</strong> manufacturing is driven by Moore’s law, which states that the<br />

number of transistors on an affordable chip will double every two years. As chipmakers<br />

start to print 20nm chips, and subsequently 10nm, 7nm and 5nm chips, the<br />

EUV solution is both cheaper and simpler than ArFi solutions. ASML’s coinvestment<br />

programme demonstrated the commitment from Intel, Samsung and<br />

TSMC to this technology, and ASML is recognised as technology leader in this<br />

field.<br />

The DP/multi-patterning (MP) process using ArFi tools (which exposes the wafer<br />

twice instead of once in order to reduce the printed feature size) is now the<br />

mainstream solution for printing 20nm chips. However, manufacturers claim that<br />

this process is too costly because it increases the number of lithography exposures<br />

per wafer, meaning that they must either reduce output or buy more tools. EUV<br />

enables chip-makers to expose the critical layer in just one exposure instead of two.<br />

In terms of total cost per wafer (see Figure 5 below), EUV delivers cost savings of<br />

34% compared with ArFi’s DP process, even if EUV tools cost twice as much to<br />

buy.<br />

Figure 5: EUV solutions deliver a cost benefit<br />

by ArFi<br />

by EUV<br />

Overall patterning cost<br />

(incl litho, etching, etc)<br />

€70.82/wafer<br />

€46.44/wafer<br />

Litho cost<br />

€23.36/wafer<br />

€31.74/wafer<br />

2*ArFi exposures/layer 1*EUV exposure/layer<br />

Litho cost/total cost 33% 68%<br />

Source: ASML data<br />

Apart from the cost savings, EUV simplifies the fabrication process by halving the<br />

steps and cycle time required in DP (see Figure 6 below). Chip-makers are likely to<br />

allocate more “critical layers” – the layers on a chip that require the highest<br />

resolution and precision to EUV from ArFi. Logic/foundries players are likely to<br />

pick up EUV first to meet the demand for small chip designs from for consumer<br />

electronics devices, and because it is more expensive for them to use DP<br />

compared to memory players.<br />

34

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