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M9306256 BIT (16 x 16) SERIAL NMOS EEPROM• SINGLE SUPPLY READIWRITE/ERASEOPERATIONS (5V±10%)• TTL COMPATIBLE• 16x16 READIWRITE MEMORY• LOW STANDBY CURRENT• LOW COST SOLUTION FOR NON VOLATILEERASE AND WRITE MEMORY• RELIABLE FLOTOX PROCESS• EXTENDED TEMPERATURE RANGEBDIP-8(Plastic Package)MS08(Plastic Micropackage)(Ordering Information at the end of the datasheet)PIN CONNECTIONSDESCRIPTIONThe M9306 is a 256 bit non-volatile sequential access<strong>memory</strong> manufactured using SGSTHOMSON FLOATING GATE process. It is aperipheral <strong>memory</strong> designed for data storageand/or timing and is accessed via a simple serialinterface.The device contains 256 bits organized as 16 x 16.The M9306 has been designed to meet applicationrequiring up to 10000 EIW cycles per word. Writteninformation has at least 10 years data retention.A power down. mode allows consumption tobe decreased.CS 1 8 VCCNC01 3 6 NC00 4 5 GNOPIN NAMESS-6969CSSKDIDOVeeGNDCHIP SELECTSERIAL DATA CLOCKSERIAL DATA INPUTSERIAL DATA OUTPUTPOWER SUPPLYGROUNDJune 19881/6211
M9306BLOCK DIAGRAM00DI---+-+-+-+------~--~INSTRUCTION'----------------1 DECODECS--~------------------~CONTROl.ANDCLOCKGENERATORSSK----------------~1_ ______ t_------~~~5-697011ABSOLUTE MAXIMUM RATINGSSymbol Parameter ValuesVI Voltage Relative to GND +6V to -0.3Tamb Ambient Operating Temperature: standard o to + 70extended -40 to +85TstQ Ambient Storage Temperature -65 to + 125UnitV°C°C°CStresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating onlyand functional operation of the device at these or any other conditions above those indicated in the operational sections of this specificationis not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability (except for T amb)2/6212
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MEMORY PRODUCTSDATABOOK1st EDITIONJ
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TABLE OF CONTENTSGENERAL INDEX Page
Page 7 and 8:
GENERAL INDEXPageROM DEVICES ......
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GENERAL INFORMATIONThe SGS-THOMSON
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SELECTION GUIDECMOS UV EPROMPart Nu
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SELECTION GUIDECMOS OTP ROMPart Num
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SELECTION GUIDEZEROPOWERPart Number
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SELECTION GUIDEFAST STATIC RAMPart
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12 32Kx8 NMOS M27256FUV EPROMPRODUC
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VFSRAMPRODUCTDESCRIPTIONSGS-THOMSON
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EPROM DEVICESNMOS UV EPROM23
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ET2716/M2716BLOCK DIAGRAM~ VPP'5V+-
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ET2716/M2716AC TEST CONDITIONSOutpu
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ET2716/M2716ERASINGThe M/ET2716 is
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ET2716/M2716SWITCHING TIME WAVEFORM
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M2732A32K (4K x 8) NMOS UV ERASABLE
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M2732AREAD OPERATIONDC AND AC CONDI
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M2732APROGRAMMING OPERATION(l) (T a
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M2732APROGRAMMING OPERATION (Contin
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M2764ABLOCK DIAGRAMDATA OUTPUT00- 0
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M2764AREAD OPERATION (Continued)AC
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M2764ADEVICE OPERATION (Continued)T
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M2764APROGRAMMING WAVEFORMSV1HADDRE
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M2764AORDERING INFORMATIONPart Numb
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M27128ABLOCK DIAGRAMVceO--GND o--
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M27128AREAD OPERATION (Continued)AC
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M27128ADEVICE OPERATION (Continued)
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M27128APROGRAMMING WAVEFORMSIVIHADD
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M27128AORDI:RING INFORMATIONPart Nu
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M27256BLOCK DIAGRAMVeco----GNOo-
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M27256READ OPERATION (Continued)AC
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M27256DEVICE OPERATION (Continued)P
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M27256PROGRAMMING WAVEFORMSPROGRAMP
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M27256ORDERING INFORMATIONPart Numb
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M27512BLOCK DIAGRAMVee o-----?GNOO-
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M27512AC TEST CONDITIONSOutput Load
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M27512DEVICE OPERATIONS (Continued)
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M27512DEVICE OPERATION (Continued)M
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M27512PROGRAMMING OPERATION (T amb=
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M27512M27512 DESIGN INNOVATIONS FOR
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M27512Figure 7 - M27512 Sensing sch
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EPROM DEVICESCMOS UV EPROM89
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ETC2716BLOCK DIAG~AM+-- vpp+-- vcc+
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ETC2716AC TEST CONDITIONSOutput Loa
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ETC2716ERASING~he ETC?716 !s erased
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ETC2716SWITCHING TIME WAVEFORMSR.ed
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ETC273232K BIT (4K x 8) CMOS UV ERA
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ETC2732READ OPERATIONDC CHARACTERIS
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ETC2732DEVICE OPERATIONThe five mod
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ETC2732PROGRAMMING WAVEFOR'''SNote:
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ETC2732SWITCHING TIME WAVEFORMSRead
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TS27C64AQ64K (8K x 8) CMOS UV ERASA
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TS27C64AQREAD OPERATIONDC CHARACTER
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TS27C64AQDEVICE OPERATIONThe seven
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TS27C64AQAC TEST CONDITIONSInput ri
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TS27C64AQORDERING INFORMATIONPart N
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TS27C256QBLOCK DIAGRAMVee 0----.GND
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TS27C256QAC TEST CONDITIONSOutput L
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TS27C256QERASINGThe TS27C256 is era
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TS27C256QHIGH SPEED PROGRAMMING FLO
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,1,;'"
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ST27C1001BLOCK DIAGRAMv P P cr-----
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M27C1024BLOCK DIAGRAMVpp 0----:---+
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M27C1024AC TEST CONDITIONSOutput Lo
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M27C,1024PROGRAM INHIBITProgramming
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M27C1024PROGRAMMING WAVEFORMSVIHADD
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M27C1024ORDERING INFORMATIONPart Nu
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ST2764AP64K (8K x 8) NMOS ONE TIME
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ST2764APREAD OPERA nONDC AND AC CON
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ST2764APDEVICE OPERATIONThe seven m
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ST2764APPROGRAMMING OPERATION (Tamb
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ST2764APFAST PROGRAMMING FLOWCHART9
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ST27128AP128K (16K x 8) NMOS ONE TI
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ST27128APREAD OPERATIONDC AND AC CO
Page 160 and 161: ST27128APDEVICE OPERATIONThe seven
Page 162 and 163: ST27128APPROGRAMMING OPERATION (Tam
Page 164 and 165: ST27128APFAST PROGRAMMING FLOWCHART
Page 166 and 167: ST27256P256K (32K x 8) NMOS ONE TIM
Page 168 and 169: ST27256PREAD OPERATIONDC AND AC CON
Page 170 and 171: ST27256PDEVICE OPERATIONThe eight m
Page 172 and 173: ST27256PPROGRAMMING OPERATION (Tamb
Page 174 and 175: ST27256PFAST PROGRAMMING FLOWCHARTF
Page 176: EPROM DEVICESCMOS OTP ROM175
Page 179 and 180: TS27C64AFN-TS27C64APBLOCK DIAGRAMVe
Page 181 and 182: TS27C64AFN-TS27C64APAC TEST CONDITI
Page 183 and 184: TS27C64FN-TS27C64APPROGRAMMINGOPERA
Page 185 and 186: TS27C64AFN-TS27C64APHIGH SPEED PROG
Page 187 and 188: TS27C64AFN~TS27C64APORDERING INFORM
Page 189 and 190: ST27C256FN-ST27C256PBLOCK DIAGRAMVc
Page 191 and 192: ST27C256FN·ST27C256PAC TEST CONDIT
Page 193 and 194: ST27C256FN-ST27C256PPROGRAMMING CHA
Page 195 and 196: ST27C256FN·ST27C256PHIGH SPEED PRO
Page 197 and 198: ST27C256FN-ST27C256PORDERING INFORM
Page 200 and 201: SGS-1HOMSON~ ., L ~D©ffi1@rn[brn©
Page 202 and 203: M8571ELECTRICAL CHARACTERISTICS (0
Page 204 and 205: M8571S-BUS DESCRIPTION (Continued)A
Page 206 and 207: M8571S·BUS INTERFACEThe serial, 3-
Page 208 and 209: M8571MASTER. READS AFTER SETTING WO
Page 210: M8571ORDERING INFORMATIONPort Numbe
Page 215 and 216: M93D6FUNCTIONAL DESCRIPTIONThe inpu
Page 217 and 218: M9306ORDERING INFORMATIONPart Numbe
Page 219 and 220: M9346BLOCK DIAGRAMDl~-r------------
Page 221 and 222: M9346FUNCTIONAL DESCRIPTIONThe inpu
Page 223 and 224: M9346INSTRUCTION SETInstruction S8
Page 225 and 226: M9346TIMING DIAGRAMS (Continued)INS
Page 228: EEPROM DEVICESCMOS EEPROM227
Page 231 and 232: ST24C02BLOCK DIAGRAMseL--~~--~-----
Page 233 and 234: ST24C02FIG. 2A· DATA TRANSFER SEQU
Page 235 and 236: ST24C02ELECTRICAL CHARACTERISTICSAC
Page 237 and 238: ST24C02FIG. 4A· PAGE WRITEBUS ACTI
Page 240 and 241: TS59C111 K BIT SERIAL CMOS EEPROM
Page 242 and 243: TS59C11READ OPERATIONDC CHARACTERIS
Page 244 and 245: TS59C11The READ instruction is the
Page 246 and 247: TS59C11FIG. 5b - ERAL (Erase all) M
Page 248 and 249: ~ SGS-1HOMSONIt.. ~ L [j\I'A]O©OO@
Page 250 and 251: TS93C46READ OPERATIONDC CHARACTERIS
Page 252 and 253: TS93C46INSTRUCTION TIMINGSREADSK ~u
Page 254: ~TS93C46ORDERING INFORMATIONPart Nu
Page 257 and 258: ST93C56BLOCK DIAGRAMPROTECTREGISTER
Page 260 and 261: M2316H16K-BIT READ ONLY MEMORY• S
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M2316HSTATIC ELECTRICAL CHARACTERIS
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M2332M233332K-BIT READ ONLY MEMORY
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M2332/M2333DC AND OPERATING CHARACT
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~ SGS-11I0MSONA., L ~D©[Ri@~[lJ~©
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M2364DC AND OPERATING CHARACTERISTI
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M236564K-BIT READ ONLY MEMORY• PI
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M2365DC AND OPERATING CHARACTERISTI
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STATIC RAM DEVICES275
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MK48Z02N2(B)-12115/20/25DESCRIPTION
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MK48Z02112(B)-12115/20/25WRITE MODE
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MK48Z02/12(B)-12/15/20/25FIGURE 6.
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MK48Z02/12(B)-12/15/20/25FIGURE 7.
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MK48Z02112(B}-12115/20/25AC TEST CO
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MK48C02A/12A(K, N)·15/20/252K x 8
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MK48C02AI12A(K,N)-15/20/25OPERATION
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MK48C02A/12A(K, N)-15/20/25DATA RET
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MK48C02A112A(K,N)-15/20/25FIGURE 6.
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MK48C02A112A(K,N)-15/20/25AC TEST C
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MK48T02/12(B)-12/15120/252K x 8 ZER
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MK48T02/12(B)-12/15/20/25OPERATIONR
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MK48T02N 2(8)-12/15/20/25CLOCK OPER
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MK48T02112(B)-12/15/20/25The FT bit
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MK48T02112(B)-12115/20/25PREDICTING
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MK48T02112(B)-12/15/20/25~redlctlng
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MK48TD2/12(B)-12115/20/25ABSOWTE MA
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M K48Z08/18/09/19(B)·15/201258K x
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MK48Z08/18/09/19(B)-15/20/25OPERATI
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MK48Z08118/09/19(B)-15/20/25AC ELEC
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MK48Z08118/09119(B)-15/20/25DATA RE
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MK48Z08118/09119(B)-15/20/25ABSOWTE
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MK48Z08/18/09/19(B)-15/20/25PACKAGE
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MKI48Z02112(B)-15/20/25DESCRIPTIONT
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M KI48Z02112(B)-15/20J25WRITE MODET
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MKI48Z02/12(B.)-15/20/25FIGURE.6. P
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MKI48Z02/12(B)-15/20/25FIGURE 7. MK
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MKI48Z02112(B)-1S/20/2SAC TEST COND
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~ SGS-THOMSON..""! L ~o©oo@rn[!J~
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MK48T08 (8)-10/12/15/20READ MODEThe
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MK48T08 (8)-10/12/15/20AC ELECTRICA
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MK48T08 (8)-10/12/15/20CLOCK OPERAT
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MK48T08 (B)-10112/15/20FIGURE 8. FR
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MK48T08 (8)-10/12/15/20rhe t 10/0 f
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MK48T08 (8)-10/12/15/20PACKAGE DESC
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STATIC RAM DEVICESCACHE TAG RAM353
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MK41 HSO(N, P)-20/25/35FIGURE 2. CO
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MK41H80(N,P)-20/25/35APPLICATIONThe
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MK41H80(N,P)-20/25/35ABSOWTE MAXIMU
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MK41 H80(N ,P)-20/25/35NORMALIZED D
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MK41H8O(N,P),-2OI2513522 PIN "P" PA
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MK4202(Q)-20TRUTH TABLERS S E WHi -
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MK4202(Q)-20DEVICE DESCRIPTION AND
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MK4202(Q)-20READ MODEThe MK4202 is
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MK4202(Q)-20COMPARE CYCLE TIMINGEle
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MK4202(Q)-20FIGURE 5. W WRITE CYCLE
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MK4202(Q)-20FIGURE 10. CHIP SELECT
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MK4202(Q)-20FIGURE 15. LATE WRITE·
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MK4202(Q)-20FIGURE 21. RESET CYCLEr
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MK4202(Q)-20AC TEST CONDITIONSInput
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MK48H74(N,P,E)·35/45/55DESCRIPTION
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MK48H74(N,P,E)-35/45/55WRITE MODETh
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MK48H74(N, P, E)-35/45/S5COMPARE MO
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MK48H74(N,P,E)-35/45/55APPLICATIONT
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MK48H74(N,P,E)-35/45/55AC TEST COND
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STATIC RAM DEVICESFIFO395
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MK4501(N,K)-65/80/10112115/20a rate
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MK4501 (N, K)-65/80/1 0112/15/20REA
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MK4501 (N, K)-65/80/10/12/15/20RESE
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M K4501(N, K)-65/80110/12115/20SING
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MK4501(N,K)-65/80110112/15/20EXPANS
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MK4501(N, K)-65/80110/12/15/20COMPO
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MK4501 (N, K)-65/80110112115/20FIGU
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~ SGS-1HOMSON,."'! I. ~u©oo@rn[brn
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MK4503(N,K)-50/65/80/10/12/15/20WRI
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MK4S03(N ,K)-SO/6S/80/1 0/12/1S/20F
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MK4503(N ,K)-50/65/80110112/15/20RE
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MK4S03(N, K)-S0/6S/80110112/1S/20HA
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MK4S03(N ,K)-SO/6S/80110112I1S/20EX
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MK4503(N, K)-50/65/80/10112/15/20CO
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MK4S03(N, K)-SO/6S/80/1 0/1211 S/20
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MK4511(N,K)-12/15/20512 x 8 CMOS Bi
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MK4511(N,K)-12115/20READ MODEThe MK
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MK4511(N,K)-12115/20DUAL PORT OPERA
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MK4511 (N,K)-12115/20IMPLEMENTATION
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MK4511(N,K)-12/15/20ABSOWTE MAXIMUM
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MK4511(N,K)-12115/20FIGURE 11. MK45
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M K4505M/4505S(N)-25/33/50DESCRIPTI
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MK4505M/4505S(N)-25/33/50AC ELECTRI
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MK4505M/4505S(N)-25/33/50FIGURE S.
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M K4505M/4505S(N)-25/33/50FIGURE 9.
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MK4505M/4505S(N)-25/33/50SIMULTANEO
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MK4505M/4505S{N)-25/33/50FIGURE 13.
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MK4505M/4505S(N)-25/33/50ABSOWTE MA
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MK4S0SM/4S0SS(N)-2S/33/S020 PIN uN"
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MK4S264/4S26S(N)-SS/70FIGURE 2. DEV
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MK45264/45265(N)-55nOAC ELECTRICAL
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MK45264/45265(N)-55noReadlWriteThe
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MK45264/45265(N)-55noFIGURE 8. FULL
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MK4S264/4S26S(N)-SSnoFIGURE 13. TRA
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MK45264/45265(N)-55noFIGURE 18. WRI
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MK4S264/4S26S(N)-SSI7OAC TEST CONDI
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MK45264/45265(~)-5snoWidth Expansio
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MK45264/45265(N)-55noORDERING INFOR
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MK41H661M K41 H67(N, P)-20/25/3516K
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MK41H66/MK41 H67(N, P)-20/25/35WRIT
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MK41H66/MK41H67(N,P)-20/25135APPLIC
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MK41H66/MK41H67{N,P)-20/25/35NORMAL
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MK41 H66/MK41 H67(N ,P)-20/25/35ORD
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MK41H681MK41H69(N,P)-20/25/354K x 4
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MK41 H68/MK41 H69(N, P)-20/25/35WRI
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MK41H68/MK41 H69(N ,P)-20/25/35APPL
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MK41 H68/MK41 H69(N ,P)-20/25/35NOR
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MK41H68/MK41H69(N,P)-20/25/35ORDERI
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t==' SGS-1HOMSON. ..,1. ~o©oo@rn[]
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MK41 H79(N,P)·20125/35WRITE MODETh
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MK41 H79(N, P)-20/25/35ITANDBY MODE
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MK41 H79(N ,P)-20/25/35"C TEST COND
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MK41H79(N,P)-20/25/35~ORMALIZED DC
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MK41 H87(N)-25/35/4564K x 1 CMOS ST
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MK41H87(N)-25/35/45WRITE MODEThe MK
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MK41H87(N)-25/35/45STANDBY MODEThe
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MK41 H87(N)-25/35/45AC TEST CONDITI
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.35, 45, 55, AND 70 ns ADDRESS ACCE
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MK48H64/MK48H65(N,P)-35/45/55noREAD
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MK48H64/MK48H65(N,P)-35/45/55noWRIT
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MK48H64/MK48H65(N,P)-35/45/55noABSO
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SALES OFFICESAUSTRALIANSW 2027 EDGE
Page 527:
Information furnished is believed t
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