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OCTOBER 19-20, 2012 - YMCA University of Science & Technology

OCTOBER 19-20, 2012 - YMCA University of Science & Technology

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Proceedings <strong>of</strong> the National Conference on<br />

Trends and Advances in Mechanical Engineering,<br />

<strong>YMCA</strong> <strong>University</strong> <strong>of</strong> <strong>Science</strong> & <strong>Technology</strong>, Faridabad, Haryana, Oct <strong>19</strong>-<strong>20</strong>, <strong>20</strong>12<br />

Acknowledgement<br />

We take this opportunity to give a sincere gratitude to DELPHI TCI, for giving an opportunity to carry out the<br />

work. We thank all the people <strong>of</strong> Delphi TCI who have supported and helped me directly or indirectly to carry<br />

out this work. Special thanks to Mr. Sangmesh Honnapurmath, EGM – Mechanical Engineering Department,<br />

Delphi TCI, Bangalore.<br />

References<br />

[1] `DAVE S. STEINBERG ASSOCIATES, <strong>20</strong>00, Vibration Analysis <strong>of</strong> Electronic Equipment’s, Third edition,<br />

Wiley-Interscience Publication.<br />

[2] SANJAY SINGH CHAUHAN, SANGMESH. H AND ARVIND KRISHNA, Effect <strong>of</strong> Mounting Structure<br />

Vibration on the Performance <strong>of</strong> Through-Hole Capacitors, Delphi Electronics & Safety.<br />

[3] ESIN, A., <strong>19</strong>81, Properties <strong>of</strong> Materials for Mechanical Design, Middle East Technical <strong>University</strong>,<br />

Gaziantep.<br />

[4] CHANDRUPATLA, <strong>19</strong>98, Finite Element Methods”, McGraw Hill Publication.<br />

[5] J.D. BOOKER, <strong>20</strong>01, “Designing Capable and Reliable Products, <strong>University</strong> <strong>of</strong> Bristol, UK Butterworth<br />

Heinemann.<br />

[6] DAVE S. STEINBERG, <strong>19</strong>88, Preventing Thermal Cycling and Vibration Failures in Electronic<br />

Equipment, presented at the 9th Annual IEEE Dayton Chapter Symposium.<br />

[7] WILLIAM Q. MEEKER, <strong>19</strong>98, Statistical Methods for Probabilistic Design”, Department <strong>of</strong> Statistics<br />

and Center for Nondestructive Evaluation Iowa State <strong>University</strong> Ames, IA 50011, Spring Research<br />

Conference, New Mexico.<br />

[8] DR. STEFAN REH, DR. PAUL LETHBRIDGE, DALE OSTERGAARD, Quality-Based Design with<br />

Probabilistic Method, Volume 2, Number 2, ANSYS Solutions.<br />

Appendix A<br />

Macro for the Monte Carlo Simulation <strong>of</strong> Probabilistic Design<br />

/PREP7<br />

!******* DEFINING THE VARIABLES******<br />

!* ask, caprad, enter the radius <strong>of</strong> capacitor, 6.25<br />

caprad=6.25<br />

!* ask, caplen, enter the length <strong>of</strong> capacitor, 21<br />

caplen=21<br />

!* ask, leadrad, enter the radius <strong>of</strong> lead, 0.3<br />

Leadrad =0.3<br />

!* ask, leadlen, enter the length <strong>of</strong> lead, 1.2<br />

leadlen=1.2<br />

!* ask, capm, Enter capacitor mass in grams, 3.24<br />

capm = 3.24<br />

pi=3.1416<br />

v=pi*(caprad**2)*caplen !Formula for capacitor volume<br />

densc=1e-6*capm/v !Formula for capacitor Density<br />

!****** DEFINING THE ELEMENT TYPE ******<br />

ET,1,PLANE42<br />

ET,2,SOLID45<br />

!****** DEFINING THE MATERIAL PROPERTIES<br />

!*Youngs modulus (EX), Density (DENSC), and Poissons ratio (PRXY)<br />

!* Material NO.1,Alluminium<br />

MP,EX,1,2.8e5<br />

MP,DENS,1,DENSC<br />

MP,PRXY,1,0.3<br />

!* Material NO.2,Copper<br />

MP,EX,2,1.17e5<br />

MP,DENS,2,8.9e-9<br />

331

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