Part-I - Controller General of Patents Designs and Trademarks

(12) PATENT APPLICATION PUBLICATION (21) Application No.159/CHE/2012 A
(19) INDIA
(22) Date of filing of Application :16/01/2012 (43) Publication Date : 21/06/2013
(54) Title of the invention : SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-
STATE IMAGE PICKUP DEVICE
(51) International classification :H01L (71)Name of Applicant :
(31) Priority Document No
:2011- 1)CANON KABUSHIKI KAISHA
026346 Address of Applicant :3-30-2, SHIMOMARUKO, OHTA-
(32) Priority Date :09/02/2011 KU, TOKYO Japan
(33) Name of priority country :Japan (72)Name of Inventor :
(86) International Application No
Filing Date
:NA
:NA
1)SAWAYAMA, TADASHI
2)IKAKURA, HIROSHI
(87) International Publication No : NA 3)KONDO, TAKAHARU
(61) Patent of Addition to Application Number
Filing Date
:NA
:NA
4)ETO, TORU
(62) Divisional to Application Number
Filing Date
:NA
:NA
(57) Abstract :
A method for manufacturing a solid-state image pickup device that includes a substrate including a photoelectric conversion unit
and a waveguide arranged on the substrate, the waveguide corresponding to the photoelectric conversion unit and including a core
and a cladding, includes a first step and a second step, in which in the first step and the second step, a member to be formed into
the core is formed in an opening in the cladding by high-density plasma-enhanced chemical vapor deposition, and in which after
the first step, in the second step, the member to be formed into the core is formed by the high-density plasma-enhanced chemical
vapor deposition under conditions in which the ratio of a radio-frequency power on the back face side of the substrate to a radiofrequency
power on the front face side of the substrate is higher than that in the first step.
No. of Pages : 66 No. of Claims : 15
The Patent Office Journal 21/06/2013 13875