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Part-I - Controller General of Patents Designs and Trademarks

Part-I - Controller General of Patents Designs and Trademarks

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(12) PATENT APPLICATION PUBLICATION (21) Application No.1278/CHE/2012 A<br />

(19) INDIA<br />

(22) Date <strong>of</strong> filing <strong>of</strong> Application :30/03/2012 (43) Publication Date : 21/06/2013<br />

(54) Title <strong>of</strong> the invention : SENSOR DEVICE<br />

(51) International classification :G02B (71)Name <strong>of</strong> Applicant :<br />

(31) Priority Document No<br />

:2011- 1)DENSO CORPORATION<br />

081938 Address <strong>of</strong> Applicant :1-1, SHOWA-CHO, KARIYA-CITY,<br />

(32) Priority Date :01/04/2011 AICHI-PREF., 448-8661 Japan<br />

(33) Name <strong>of</strong> priority country :Japan (72)Name <strong>of</strong> Inventor :<br />

(86) International Application No<br />

Filing Date<br />

:NA<br />

:NA<br />

1)KONDO, JUN<br />

2)SERIZAWA, KAZUFUMI<br />

(87) International Publication No : NA<br />

(61) Patent <strong>of</strong> Addition to Application Number<br />

Filing Date<br />

:NA<br />

:NA<br />

(62) Divisional to Application Number<br />

Filing Date<br />

:NA<br />

:NA<br />

(57) Abstract :<br />

A sensor device 2 where a jig 3 is engaged to an engaging part 213 formed in the housing 21, <strong>and</strong> the housing 21 is rotated by the<br />

jig 3 <strong>and</strong> screwed into the member to be mounted 1. A position in the rotating direction <strong>of</strong> the housing 21 is configured to have a<br />

substantially constant position at the time the screw-fixing <strong>of</strong> the housing 21 <strong>and</strong> the member to be mounted 1 is completed. A<br />

shape <strong>of</strong> the engaging part 213 when seen along a direction <strong>of</strong> a rotational axis X <strong>of</strong> the housing 21 is formed into a non-regular<br />

polygon, <strong>and</strong> the engaging part 213 <strong>and</strong> a mold IC 23 are shifted <strong>and</strong> disposed to a side that has a margin in a space in the housing<br />

21 or around the mold IC 23 so that the space around the sensor device 2 is used effectively.<br />

No. <strong>of</strong> Pages : 16 No. <strong>of</strong> Claims : 7<br />

The Patent Office Journal 21/06/2013 13906

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