Part-I - Controller General of Patents Designs and Trademarks

(12) PATENT APPLICATION PUBLICATION (21) Application No.206/CHE/2012 A
(19) INDIA
(22) Date of filing of Application :18/01/2012 (43) Publication Date : 21/06/2013
(54) Title of the invention : DIE ATTACH COMPOSITION FOR SILICON CHIP PLACEMENT ON A FLAT SUBSTRATE
HAVING IMPROVED THIXOTROPIC PROPERTIES
(51) International classification :H01J
(31) Priority Document No :13/008,428
(32) Priority Date :18/01/2011
(33) Name of priority country :U.S.A.
(86) International Application No
:NA
Filing Date
:NA
(87) International Publication No : NA
(61) Patent of Addition to Application Number :NA
Filing Date
:NA
(62) Divisional to Application Number
:NA
Filing Date
:NA
(71)Name of Applicant :
1)Lexmark International Inc.
Address of Applicant :Intellectual Property Law
Department 740 West New Circle Road Bldg 082-1
Lexington Kentucky 40550-0999
(72)Name of Inventor :
1)GRAHAM David
2)PROVENCE Joel
3)SINGH Jeanne Marie Saldanha
4)WELLS Richard D.
U.S.A.
(57) Abstract :
A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a crosslinkable
epoxy resin having a rigid backbone an epoxy siloxane resin a fumed silica filler an amine curing agent and a silane
coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in
forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat
ceramic substrate and exhibits good ink resistance.
No. of Pages : 24 No. of Claims : 16
The Patent Office Journal 21/06/2013 13989